May 14, 2026By Tim Wang Lee, Ph.D., Keysight TechnologiesWhen Frequency Shapes Time: How S-Parameter Properties Shape Simulated TDR Behavior
May 13, 2026By Jiyue Zhu, Regina Thahir, Xiaoyan Xiong, Gang Kang, and Jian Liu, Cadence, San Jose, Calif.Machine Learning Models for SI/PI Analysis with Meshed Planes
May 11, 2026By Istvan Novak, SamtecEvolution of the PDN Design Process: Explaining the Second Paradigm Shift
April 21, 2026By Steve Sandler, PicotestUltra-Low Insertion Inductance, Ultra-High-Bandwidth Resistors
February 28, 2026By Shawn Luke, DigiKeyBuilding Cyber-Resilient Embedded Systems: Insights from Industry Leaders
August 24, 2025By Steve Sandler, PicotestAI in Power and Signal Integrity Design: Revolutionary or Overhyped?
April 1, 2024By Eric BogatinBogatin’s Practical Guide to Transmission Line Design and Characterization for Signal Integrity Applications
May 24, 2023By Andrew Josephson, Brandon Gore, and Jonathan Sprigler, SamtecSelecting a Backplane: PCB vs. Cable for High-Speed Designs
July 7, 2022By Benjamin DannanImproved Methodology to Accurately Perform System Level Power Integrity Analysis Including an ASIC die
