Maintain SI at 224 Gbps PAM4 by Moving Beyond Traditional Design Techniques
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Subscribe or login to download the latest issue of Signal Integrity Journal which highlights High Speed Interconnect Technologies and other important SI/PI topics in the following articles:
- Maintain SI at 224 Gbps PAM4 by Moving Beyond Traditional Design Techniques,” Sandeep Sankararaman and Brandon Gore, Samtec
- PCIe 7.0 Requires New Testing Processes and Instrumentation, Hiroshi Goto, Anritsu Company
- The Other Half of the Launch: Return-Path Considerations in Coaxial-to-GCPW Interconnects, Jason Yoho and Madrone Coopwood, HYPERLABS
- How Close Is Close Enough? A Similarity Metric Rubric for Advanced Packaging Interconnect Virtual Prototypes, Tim Wang-Lee, Keysight Technologies
- Probe-Tip Launch Effects on Differential PCB, Measurement Accuracy from 40 to 110 GHz, Brian Shumaker, DVT Solutions, LLC
- Inside the First AI Orchestrator for Signal Integrity: An Interview with Simbeor Commander, Yuriy Shlepnev, Simberian Inc.
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