Technical Articles

Compute Accurate Short Term Frequency Stability  Metrics of Periodic Timing Signals Cover 10-2-24.jpg

Compute Accurate Short Term Frequency Stability Metrics of Periodic Timing Signals

Making accurate time interval error (TIE) or phase noise measurements of a periodic signal presents a number of challenges. The program jitterhist includes algorithms and settings to provide accurate TIE measurement results for periodic waveforms with significant amounts of high-frequency measurement/modulation noise as well as for waveforms having multiple unit intervals of low frequency modulation when the time span of the samples includes more than one period of the modulation. 


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200+ Gbps Ethernet Forward Error Correction (FEC) Analysis

DesignCon 2024 Best Paper Award Winner

In order to study what is needed and what has been adopted for the next Ethernet speed node of 200 Gbps per lane, this DesignCon 2024 paper, a recipient of the Best Paper Award, investigates different FEC schemes such as end-end, concatenated, and segmented FECs, examining how these different FEC schemes affect signal integrity and performance in different end applications. 


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Who Put That Inductor in My Capacitor Cover 2024.jpg

Who Put That Inductor in My Capacitor?

This article covers the importance of proper calibration, measurement, and de-embedding to ensure that the final capacitor model is free of errors, allowing an accurate representation of the PDN used in simulation. While capacitor models may play a seemingly minor role in the overall system design, the impact of capacitor models can significantly impact the system design and, importantly, design sign-off.


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Enhancing Electromagnetic Compatibility in Vehicle Infotainment Displays via CISPR 25 Methodology

This article identifies the primary culprit behind the elevated radiation emission levels during CISPR-25 compliance assessments and presents practical solutions for regulatory adherence that impact automotive design and testing while supporting the evolution of more refined EMC standards. Read on to learn how this approach enhances vehicle safety and performance by addressing electromagnetic interference.



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Introducing an Upcoming IEEE Packaging Benchmark

In recent years, the IEEE Electrical Packaging Society technical committee for electrical design, modeling, and simulation recognized the need for open-source benchmarks for the simulation tool, verification, and test and measurement solution vendors. The intention is to overcome the obstacles that developers and users of such tools and instruments often encounter and create a growing library of benchmark cases for signal and power integrity challenges. As of October 2023, there are four published benchmark cases in the repository. This article describes a proposal for a fifth benchmark.


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