Benjamin Dannan has a multi-faceted background that includes a wide range of professional engineering and military experiences. His professional engineering experience includes over 11 years of designing, developing, and launching production products, ranging from fully autonomous robotic platforms, to pan-tilt-zoom (PTZ) camera video systems, to ground combat vehicles. His design experience includes developing solutions for high-volume, high-reliability, harsh environments, which also entails high-speed PCBA design, mechatronics design, sensor design, as well as designs for solutions that meet EMC susceptibility or radiated EMI requirements. He is a specialist in signal and power integrity concepts, high-speed circuit and multi-layered PCB design, vision systems, robotics, as well as has multiple years of experience with EMC product development and certifications to support global product launches. Benjamin also holds a certification in cybersecurity. He graduated from Purdue University with a BSEE in May 2009, and from USAF Undergraduate Combat Systems Officer training with an Aeronautical rating, in September 2012. Benjamin is also a trained Electronic Warfare Officer in the USAF with deployments on the EC-130J Commando Solo in Afghanistan and Iraq totaling 47 combat missions. In addition, Benjamin holds three patents in his name. He recently completed his Masters of Engineering in Electrical Engineering from The Pennsylvania State University. In addition, Benjamin is a senior member of IEEE.
As DDR data transmission rates continue to increase, the signal integrity of the DDR channel has become one of the most critical concerns. This article takes an extensive look at the impact of via stubs on the impedance of the signal lines on DDR4 memory, including test cases and ways to optimize design.
Low-speed printed circuit board (PCB) designs now have to deal with high-speed switching problems. This article examines the ground bounce generated from an LCD assembly while evaluating the impact of the ground bounce on the system level EMI. Three solution strategies to mitigate the ground bounce are analyzed, the pros and cons of each strategy are provided along with the test results.