Benjamin Dannan

Benjamin Dannan

Benjamin Dannan is a Staff Digital Engineer at Northrop Grumman, with a multi-faceted background that includes a wide range of professional engineering and military experiences. He is a senior member of IEEE, with professional engineering experience that includes over 12 years of designing, developing, and launching production products, ranging from fully autonomous robotic platforms, to pan-tilt-zoom (PTZ) camera video systems, to ground combat vehicles. His design experience includes developing solutions for high-volume, high-reliability, harsh environments, which also entails high-speed PCBA design, mechatronics design, sensor design, as well as designs for solutions that meet EMC susceptibility or radiated EMI requirements. He is a specialist in signal and power integrity concepts, high-speed circuit and multi-layered PCB design, vision systems, robotics, as well as has multiple years of experience with EMC product development and certifications to support global product launches. Benjamin holds a certification in cybersecurity, has a BSEE from Purdue University, a Masters of Engineering in Electrical Engineering from The Pennsylvania State University, and graduated from the USAF Undergraduate Combat Systems Officer training school with an aeronautical rating. Benjamin is a trained Electronic Warfare Officer in the USAF with deployments on the EC-130J Commando Solo in Afghanistan and Iraq totaling 47 combat missions, as well as a trained USAF Cyber Operations Officer. He has co-authored multiple peer-reviewed journal publications. He received the prestigious DesignCon 2020 best paper award, given to authors leading as practitioners in semiconductor and electronic design. In addition, Benjamin has been awarded three U.S. patents and one international patent in his name. In 2020, Benjamin was elected to board on Army RDT&E, Systems Acquisition, and Logistics BARSL serving ASAALT.



1591 thumb

How Ground Bounce Can Ruin Your Day

Low-speed printed circuit board (PCB) designs now have to deal with high-speed switching problems. This article examines the ground bounce generated from an LCD assembly while evaluating the impact of the ground bounce on the system level EMI. Three solution strategies to mitigate the ground bounce are analyzed, the pros and cons of each strategy are provided along with the test results.

Read More