SIJ 2023 Issue, "How Interconnects Work: Characteristic Impedance and Reflections"
Subscribe to download this issue of Signal Integrity Journal featuring articles from industry experts including:
Identifying and Solving EMC/EMI Problems
The need to address EMC/EMI problems has never been more pressing. As electronic devices become smaller, faster, and more powerful, the potential for interference grows exponentially. It's no longer sufficient to simply design and build electronic systems without considering their EMC/EMI characteristics. Engineers, designers, and technicians must proactively identify and mitigate these issues to ensure that their products meet regulatory standards, perform reliably, and avoid costly setbacks. This eBook provides an understanding of the underlying principles, practical methodologies, and advanced techniques for dealing with EMC/EMI challenges. It is designed for both newcomers seeking a foundational knowledge of the subject and experienced professionals looking to deepen their expertise.
Getting the Jitter Out - High Speed Communications Timing Technology
This eBook focuses on jitter, simply defined as any effect that causes signal threshold crossing times to deviate from their expected positions. The first article addresses the inter-relationships between jitter and other noise-generating mechanisms.
End-to-End High-Speed Digital Design
High-speed digital links at 224 Gbps per lane, device miniaturization, and ultra-low power budgets result in sophisticated systems that are more complex to optimize signal integrity performance and reliability. Engineers require close collaboration and seamless flows from concept to simulation, emulation, and testing to keep up with technology's pace and meet shrinking time-to-market expectations.
This eBook covers how to connect design workflows to make end-to-end high-speed digital design a reality. It will discuss the challenges and trade-offs associated with optimizing design performance for technologies such as PCIe 6.0, USB4 Version 2.0, and USB-C, DDR5, and LPDDR.