Featured e-Books

• SIJ April 2026 Issue: AI-Assisted HFSS Modeling For 100 GHz+ High-Speed Interconnect Design

  Featuring articles from industry experts, including AI-Assisted HFSS Modeling for 100 GHz+ High-Speed Interconnects, HYPERLABS; Why Power Architectures Constrain New Space AI Missions, Vicor; ML Models for SI\PI Analysis with Meshed Planes, Cadence; Modern Closed–Loop Stability in ADS, Signal Edge Solutions/Picotest/Keysight; Evolution of the PDN Design Process, Samtec; and more.read more

• Advanced Packaging and SI: Simulating Electromagnetic, Thermal, and Mechanical Effects

  Explore how multiphysics simulation is helping engineers overcome the challenges of advanced packaging and signal integrity design. This eBook highlights simulation-driven approaches for improving high-speed performance, thermal management, reliability, and design efficiency in next-generation electronic systems. read more

• Challenges in High-Speed Interconnect Guide

  The articles in this eBook provide a comprehensive view of the technical hurdles and emerging solutions, shaping the future of high-speed interconnect design. read more