Technical Articles

Comparing Embedded Coplanar Waveguide and Stipline for Multi-Layer Boards

By Mohanad Abulghasim, Justin Tabatchnick, and Milica Markovic

EDI CON China 2019 Event Summary

By Patrick Hindle

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Technical Articles

The 2-Port Shunt-Thru Measurement and the Inherent Ground Loop

By Anto Davis and Steve Sandler

Technical Articles

BER- and COM-Way of Channel-Compliance Evaluation: What are the Sources of Differences?

By Vladimir Dmitriev-Zdorov, Cristian Filip, Chuck Ferry, and Alfred P. Neves

Events

26May
DG CON 2019
Herzliya
18Jun
EMC Expo 2019
Beijing
18Jun
IEEE Workshop on Signal and Power Integrity (SPI)
Chambery

Signal Integrity

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Technical Articles

Practical Application of the IEEE P370 Standard for Measurement of Interconnects up to 50 GHz

By Jay Diepenbrock, Heidi Barnes, Eric Bogatin, Ching-Chao Huang, Jason Ellison, Mikheil Tsiklauri Ph.D., and Xiaoning Ye Ph.D.

Technical Articles

IEEE P370: A Fixture Design and Data Quality Metric Standard for Interconnects up to 50 GHz

By Jay Diepenbrock, Eric Bogatin, Heidi Barnes, Jason Ellison, Mikheil Tsiklauri Ph.D., Xiaoning Ye Ph.D., and Ching-Chao Huang

Technical Articles

PAM4: For Better and Worse

By Ransom Stephens

Technical Articles

Demystifying Edge Launch Connectors

By Raul Stavoli, Davi Correia, and Emad Soubh

Special Report

Executive Q&A: Ken Willis, Product Engineering Architect at Cadence

More Signal Integrity

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Sponsored Content

New 112G Submersible Optical Transceiver

Power Integrity

Technical Articles

Avoid These Two Artifacts When Measuring SMPS Power Rails

By Eric Bogatin and Harshith Alvakonda

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Executive Q&A: Steve Sandler, Founder of Picotest

Technical Articles

Target Impedance Is Not Enough

By Larry Smith, Steve Sandler, and Eric Bogatin

Technical Articles

Preamplifier Options for Reducing Cable-Braid Loop Error

By Istvan Novak

Technical Articles

VRM Modeling: A Strategy to Survive the Collision of Three Worlds

By Steve Sandler, Larry Smith, and Eric Bogatin

More Power Integrity

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Sponsored Content

EMI Debugging on Board Level

By Rohde & Schwarz

EMC/EMI

Keysight

Keysight Technologies Announces New Time Domain and Real Time Scan Capabilities in EMI Receiver Solution

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EMV 2019: Rohde & Schwarz Adds New Automated EMC Test Solutions to Its EMC Test Portfolio

Industry News

Dow Spotlights Thermally and Electrically Conductive Materials at MWC Barcelona

Industry News

Rohde & Schwarz Significantly Increases Functionality of R&S ELEKTRA EMC Test Software

Industry News

High-current Noise Suppression Filters for Audio Lines

Buyer's Guide

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Click this featured vendor's logo for the latest SI, PI and EMC/EMI products, catalogs, brochures and company news.

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Sponsored Content

Triggering Read and Write Cycles of DDR3 Memories

By Rohde & Schwarz

Featured Videos

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Invited Keynote at EDI CON China 2019 on Power Integrity

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R&S Keynote on 5G OTA at EDI CON China 2019

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Featured Products

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Passive Plus, Inc. Broadband Ceramic Capacitors with New 6.3V Rating

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Cinch Connectivity Solutions Announces Availability of the Fibreco S-Lite Connector Series

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Richardson RFPD Introduces New Family of 650 V GaN E-HEMTs from GaN Systems

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White Papers and App Notes

Vectorstar

Using VNAs as a Tool for Signal Integrity in High Speed Digital Systems

VNAs make measurements in the frequency domain and can be used to supplant the information that native time domain instruments, like fast oscilloscopes, Signal Quality Analyzers (BERTs) and Time Domain Reflectometers/Transmission instruments (TDR/TDT’s) already provide.

Defying Convention to Achieve Faster Signal and Simulation Speeds

An efficient computational design optimization method, combining full-wave electromagnetic simulation in COMSOL Multiphysics® software with a space-mapping (SM) algorithm implemented in MATLAB® software.

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The Fast Track to PCIe 5.0

Data center operators must embrace next-generation technologies to support the response times and bandwidth requirements of 5G and IoT. 400GE requires faster memory and faster serial bus communications.

More on White Papers and App Notes

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Sponsored Content

SIJ Publishes January 2019 Issue