Featured e-Books

• SIJ October 2026 Issue: Maintain SI at 224 Gbps PAM4 by Moving Beyond Traditional Design Techniques

  Featuring insights from experts at Samtec, Anritsu, HYPERLABS, Keysight Technologies, DVT Solutions, and Simberian, this issue explores 224 Gbps PAM4 signal integrity, PCIe 7.0 testing, coaxial-to-GCPW interconnects, advanced packaging simulation, high-frequency PCB measurements, and AI-driven signal integrity analysis. read more

• Advanced Packaging and SI: Simulating Electromagnetic, Thermal, and Mechanical Effects

  Explore how multiphysics simulation is helping engineers overcome the challenges of advanced packaging and signal integrity design. This eBook highlights simulation-driven approaches for improving high-speed performance, thermal management, reliability, and design efficiency in next-generation electronic systems. read more

• Challenges in High-Speed Interconnect Guide

  The articles in this eBook provide a comprehensive view of the technical hurdles and emerging solutions, shaping the future of high-speed interconnect design. read more