Janine Love currently serves as a contributing editor to Signal Integrity Journal, a market she is very familiar with from her work as the technical program director for DesignCon. In addition, Janine is responsible for programming the technical content at EDI CON USA and EDI CON CHINA, two-events co-organized by Signal Integrity Journal and Microwave Journal.
This spring, Molex and Samtec announced a collaboration on next-generation data center solutions. SIJ caught up with Brian Vicich of Samtec, Inc and Brent Hatfield of Molex to find out what that means for engineers.
EDI CON USA, the industry event that brings together RF/microwave and high speed digital design engineers and system integrators, is happy to announce its technical program co-chairs for the 2018 USA event.
This March 20-22, EDI CON CHINA will take place at the China National Convention Center in Beijing, China. This year’s event brings its unique, high-quality technical conference with learning and training opportunities back to Beijing.
EDI CON China 2018, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place March 20-22, 2018 at the China National Convention Center (Beijing, China), announces registration is now open and the technical program is now live at www.ediconchina.com.