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Back to Beijing - EDI CON China 2018 Event Review

After last year’s EDI CON China event taking place in Shanghai, EDI CON China returned to Beijing at the Chinese National Convention Center directly across from the Olympic Park. Close to 3,000 unique attendees participated in the conference with more than 125 companies in the exhibition. Read this complete review of the event.


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DesignCon 2018 Preview

DesignCon 2018 will feature a 14-track conference covering the latest developments in hardware and high-speed communications design. The conference will also have over 100 technical sessions, three full day boot-camps, and more. Signal Integrity Journal has collected the following exhibition highlights as a preview to what you will see in the exhibition hall.


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EDI CON USA Keynote Talks - Bet Your Job, 5G in 5 Years and T&M Value

Full videos of Scott McMorrow, Thomas Cameron and Faride Akretch keynote talks

The EDI CON USA 2017 keynote speakers addressed the latest engineering trends and challenges in our industry from “in the trenches” stories of design challenges, successes and failures from “Bet Your Job” to “5G in 5 Years” look into the future to a behind the scenes look at T&M. Below are full videos of these featured talks delivered on Sept 12 in Boston.


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Teledyne LeCroy and Anritsu Integrate Best-in-Class Solutions to Create Industry’s Most Comprehensive PCI Express® 4.0 Test System

Teledyne LeCroy, Inc. and Anritsu Company U.S. announce today a partnership to provide the industry’s most capable PCI Express 4.0 (PCIe Gen4) test solution, integrating the Anritsu Signal Quality Analyzer (SQA) MP1900A BERT with the LabMaster 10Zi-A oscilloscope and QPHY-PCIe4-Tx-Rx software from Teledyne LeCroy. This comprehensive system provides high-speed IC, device, and network engineers with one complete solution to conduct automated transmitter and receiver compliance tests, as well as link equalization verification.


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DC Blocking Capacitor Location, who cares?

It's a fact, the older I get, the dumber I become. I came to that realization while thinking about this eternal question engineers have about placement of high speed DC blocking caps in serial link channels. A few years ago I would have been able to recite the pros and cons without hesitation, but now, after playing manager for a few years, before I answer I have to pause and think about it. Fortunately the answer comes back quickly and I can still sleep at night. I find this topic interesting for a few reasons; one, it's a very practical issue found in almost every high speed design, and second, and perhaps more importantly, it's one of those topics were intuition might lead you the wrong way.


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IMAGE GALLERIES

EDI CON China 2018

Beijing, China

DesignCon 2018

Santa Clara, CA

EDI CON USA 2017

Boston, MA