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DesignCon 2018 Preview

DesignCon 2018 will feature a 14-track conference covering the latest developments in hardware and high-speed communications design. The conference will also have over 100 technical sessions, three full day boot-camps, and more. Signal Integrity Journal has collected the following exhibition highlights as a preview to what you will see in the exhibition hall.

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EDI CON USA Keynote Talks - Bet Your Job, 5G in 5 Years and T&M Value

Full videos of Scott McMorrow, Thomas Cameron and Faride Akretch keynote talks

The EDI CON USA 2017 keynote speakers addressed the latest engineering trends and challenges in our industry from “in the trenches” stories of design challenges, successes and failures from “Bet Your Job” to “5G in 5 Years” look into the future to a behind the scenes look at T&M. Below are full videos of these featured talks delivered on Sept 12 in Boston.

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Teledyne LeCroy and Anritsu Integrate Best-in-Class Solutions to Create Industry’s Most Comprehensive PCI Express® 4.0 Test System

Teledyne LeCroy, Inc. and Anritsu Company U.S. announce today a partnership to provide the industry’s most capable PCI Express 4.0 (PCIe Gen4) test solution, integrating the Anritsu Signal Quality Analyzer (SQA) MP1900A BERT with the LabMaster 10Zi-A oscilloscope and QPHY-PCIe4-Tx-Rx software from Teledyne LeCroy. This comprehensive system provides high-speed IC, device, and network engineers with one complete solution to conduct automated transmitter and receiver compliance tests, as well as link equalization verification.

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DC Blocking Capacitor Location, who cares?

It's a fact, the older I get, the dumber I become. I came to that realization while thinking about this eternal question engineers have about placement of high speed DC blocking caps in serial link channels. A few years ago I would have been able to recite the pros and cons without hesitation, but now, after playing manager for a few years, before I answer I have to pause and think about it. Fortunately the answer comes back quickly and I can still sleep at night. I find this topic interesting for a few reasons; one, it's a very practical issue found in almost every high speed design, and second, and perhaps more importantly, it's one of those topics were intuition might lead you the wrong way.

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EMC in the Capital

IEEE EMC SI/PI 2017 Summary

The 60th IEEE EMC SI/PI Symposium took place August 7-11 at National Harbor in Washington DC with the “plan to inspire, envision, and innovate.” The keynote set the stage for this plan as Julius Knapp, FCC Chief of the Office of Engineering and Technology, discussed the status of the FCC and industry EMC standards, the equipment authorization program and enforcement as the wireless space becomes more and more crowded with emerging technologies such as IoT, connected/autonomous vehicles, UAVs, increased satellite broadband and 5G taking off.

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The Role of PCB Materials in Printed-Circuit Impedance

Printed circuits for high-speed and high-frequency applications rely on fine-featured transmission lines for signal transmission. Ideally, the loss through these transmission lines is minimal, and this requires an electrical impedance that is consistent and without interruptions, and with a value most appropriate for the types of signals to be transferred through the circuit. However, a number of factors can affect the impedance of a PCB, including the physical and electrical characteristics of the circuit and circuit material, but by reviewing and better understanding these variables, their effects can be minimized.

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DesignCon 2018

Santa Clara, CA


Boston, MA