Signal Integrity

Signal integrity covers all the issues about single ended and differential signal propagation from the transmitter to the receiver, including problems such as impedance control, discontinuities, reflections, topology, terminations, losses, ISI, jitter, eye diagrams, cross talk and ground bounce.

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  • Thumb-for-108
    By Douglas Brooks

    PCB Trace Current/Temperature Relationships and their Dependencies

    The ability to analyze and predict the current/temperature effects of isolated traces is helpful, but the actual temperature of a trace may be different because of uncertainties in the actual trace thickness or board material thermal conductivity coefficient. This article traces the effort to see what PCB board parameters have the most impact in determining trace temperatures, followed by a look at related PCB design considerations. Read on to learn more.

  • 17pml023_eye_diagram_huita
    By NIST: National Institute of Standards and Technology

    Microwave-Based Test Method Can Help Keep 3-D Chip Designers’ Eyes Open

    Researchers at the National Institute of Standards and Technology (NIST) have invented a new approach to testing multilayered, three-dimensional computer chips that are now appearing in some of the latest consumer devices. The new method may be the answer the semiconductor industry needs to quickly assess the reliability of this relatively new chip construction model, which stacks layers of flat circuitry atop one another like floors in a building to help make chips ever-faster and packed with features.

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