Blog Postings

The Evolutionary Path to the 100 Amp Micromodule Regulator

A micromodule device resembles a surface mount IC; however, they include all the necessary support components that would normally be used to construct a power conversion circuit. This includes a DC/DC controller, MOSFET dice, magnetics, capacitors and resistors and so on, all mounted on a thermally efficient laminate substrate. They are then encapsulated using a plastic mold cap. The result was a complete power supply that can be simply adhered to a printed circuit board. Read about the evolution of this device.


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Just how good are VNA Measurements?

Just because someone has a VNA capable of 60 GHz bandwidth doesn’t mean it will always give the same results. It is not the instrument, but the measurement procedure that seems to influence the quality of the measurements the most.  Read on for information on a recent study from Jason Ellison, Heidi Barnes, and Jose Moreira  as well as 7 tips for improving your measurements.


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The Future of Power Integrity

Get six experts in a room together and you are likely to hear seven different opinions. Not so at the Future of Power Integrity Panel Discussion at DesignCon 2019.  The consensus of this panel of experts is that the future of power integrity will include single processor chips drawing as much as 1000 A and more. Read on for the details of this discussion!


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Test System Addresses Demands of 56/112G PAM4 Using Upcoming IEEE P370 Standard

eSilicon was in the Samtec booth at DesignCon 2019 presenting their collaboration with Wild River Technology to develop an advanced test system that addresses the difficult signal integrity demands of 56/112G PAM4 operation. The test system design utilizes the upcoming IEEE P370 standard in association with compliance metrics 802.3bs, OIF CEI – 56G PAM4, and COBO to validate the required performance.


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EDI CON USA Comes to California!

Two full days of technical programming, the EDI CON University, panels, exhibition, networking and show floor presentations covering RF, microwave, signal integrity, power integrity and EMC/EMI await this year’s attendees in sunny Santa Clara, California.
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