Eric Bogatin

Eric Bogatin

Eric Bogatin is the Technical Editor at Signal Integrity Journal and the Dean of the Teledyne LeCroy Signal Integrity Academy. Additionally, he is an Adjunct Professor at the University of Colorado-Boulder in the ECEE Dept. Eric improves the signal to noise ratio by sorting through all of the information available and finding the best quality content to publish on signalintegrityjournal.com.

ARTICLES

Avoid These Two Artifacts When Measuring SMPS Power Rails

Switch-mode power supplies (SMPS) are commonly used DC-to-DC converters in many electronic components. By their nature, they can generate a lot of radiated emissions. Unless care is taken, it is difficult to separate what is the actual voltage on the power rail and what is an artifact due to the way we probe the circuit. The project outlined here shows how to avoid EMI pick-up and cable reflection noise.


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Quick, Simple Way to Measure the System Bandwidth of a Scope-Probe System

While we get the scope’s bandwidth from the vendor, as soon as we add a cable, probe, or amplifier to the scope, we decrease the system bandwidth. The new system bandwidth is as important to know as the scope’s bandwidth, but it is generally difficult to measure except in a calibration lab. We offer a simple method of evaluating the transfer function and system bandwidth of any probing system using a wide band noise source. This method not only gives us information about the probes and interconnects, but it also tells us how the scope responds to the measurement system, information which cannot be measured by a VNA alone.


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Target Impedance Is Not Enough

Target impedance has become a standard tool when designing a power distribution network (PDN). It establishes a limit to the highest impedance the power rail on the die should see looking into the PDN. If the PDN impedance stays below this limit, even the worst-case transient current from the die will generate an acceptably low rail voltage noise.


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VRM Modeling: A Strategy to Survive the Collision of Three Worlds

This paper reviews four levels of VRM models that VRM designers, board level interconnect designers, semiconductor designers, and product managers often use to explore design tradeoffs throughout the PDN system. The choice of which one to use involves considering engineers’ levels of expertise and what problems they expect to analyze. Some tradeoffs and relative merits of the models are described.


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EDI CON Conversations Offer New Insights

The third Electronic Design Innovation Conference (EDICON), was held Oct 17-18, 2018 in Santa Clara. The attendees were treated to two days of technical talks, tutorials and tradeshow with the overlapping topics of RF, SI, PI and EMI. This is a unique combination, allowing cross fertilization between these otherwise separate fields.


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