Featured White Papers

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This application note presents an efficient methodology for modeling 3D interconnects incorporating hatched return planes in silicon interposers, silicon bridges, and flex PCBs. The approach combines a specially designed quasi-static 2D field solver with full 3D electromagnetic analysis within a mixed-domain modeling framework.

Learn about the sources of noise in high-speed sampling systems and how they impact measurements across ranges, bandwidth, and sampling. We will discuss the keys to avoiding measurement error and making sure to accurately compare apples to apples when discussing noise performance along with the Siglent SDS7804AP oscilloscope.

At data rates of 100 Gb/s and beyond, RF cable instability can affect the accuracy, repeatability, and confidence of high-speed differential channel measurements. This white paper explores how Maury Microwave stable RF cable assemblies can help minimize cable-induced variations and create a more reliable measurement environment.

High-speed Serializer/Deserializer (SERDES) is the backbone of digital communication systems used in Ethernet, PCIe, data storage, and high-speed digital interfaces. This application note demonstrates how the Maury Microwave J7000B noise generator enables SERDES testing through receiver sensitivity characterization, bit error rate (BER) testing, and link margin analysis.

Can copper continue to scale for next-generation AI data center interconnects? Developed by TE Connectivity in collaboration with Semtech, this DesignCon 2026 Best Paper Award-winning technical paper explores passive and active copper architectures—including DAC, ACC, and Co-Packaged Copper (CPC)—and how they can help enable the transition to the 448G era.

This solution brief introduces Keysight 3D Interconnect Designer, a physically aware environment for early exploration and validation of advanced interconnect architectures. It enables modeling and analysis of complex 2.5D and 3D structures during the architectural phase, helping teams reduce risk, accelerate development, and improve confidence before detailed physical implementation.

Precision measurements depend on stable phase performance in cable assemblies. This article explores cable construction, common phase instability causes, and practical methods to measure and characterize phase stability. Understanding these factors helps minimize errors, improve repeatability, and guides engineers in selecting the ideal cable for reliable, high-frequency testing.

This application note examines chiplet design, outlining the rationale behind the shift to chiplet-based systems and emphasizing their cost efficiency and scalability. With practical examples and recommendations, learn how to navigate the complexities of signal integrity analysis of chiplet designs using the Keysight Chiplet PHY Designer.

Are you an engineer who needs to boost signal clarity with digital pre-distortion? This step-by-step guide shows how to use the Rohde & Schwarz SMW200A and FSW to linearize output signals and improve EVM. Ideal for engineers optimizing RF performance in satellite and 5G systems.

The rise of AI, cloud, and IoT is driving data center expansion, enhancing communication speed, optical modules, and storage. This document explores data transmission technologies, testing solutions, and the importance of measuring signals for compliance. Anritsu ensures efficient, reliable testing to support modern data center networks.