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Industry News
Menlo Micro Introduces World’s First 64 Gbps Fully Integrated Loopback Solution for High-Speed Data Connectivity
New MM5620 System-In-Package Reduces Cost-of-Test for Demanding High-Speed Data Connectivity Applications Including Emerging PCI Express, DDR and SerDes standards
Xpeedic Releases Notus at DesignCon2023, Announces Upgrades to Advanced Packaging and High-Speed Digital Solutions
Ongoing DesignCon Booth Demonstrations Highlight Comprehensive Xpeedic Portfolio
Sustained Broadband Spending Expected Through 2027, According to Dell’Oro Group
XGS, 25G, and Early 50G PON Rollouts to Fuel Spending
Anritsu to Showcase Test Leadership for High-speed Communications Verification at DesignCon 2023
Global Test Provider to Demonstrate Integrated Solutions and Thought Leadership that Address PCIe® 6.0, Other Technologies
Junkosha showcases range of mmWave cabling solutions designed for a 5G/6G digital future at DesignCon
Interconnect pioneers use premier electronics industry event to demonstrate its digital cable solutions capabilities
Liquid Instruments to Showcase Major Enhancements to Moku:Go and Moku:Pro Devices at SPIE Photonics West
Test and measurement innovator is unveiling a range of software updates to its Moku product series to help users optimize workflow and accelerate research and discovery