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Richardson Electronics, Ltd., announces the FET-Jet calculator by UnitedSiC, an excellent tool to find the most optimized SiC device in the early stages of power design.

The K88 option for R&S RTO and R&S RTP oscilloscopes from Rohde & Schwarz enables compliance testing on the next evolution of the automotive Ethernet standard.

Rohde & Schwarz launched the R&S ZNA, the industry’s first purely touch-operated vector network analyzer, originally two years ago. These models cover frequency ranges of up to 50 GHz and 67 GHz.

Avishtec announced the availability of the latest version of its Gauss 2D Field Solver toolset with accurate insertion loss modeling that accounts for ground plane losses, new capabilities for broadband extraction of dielectric properties and conductor roughness parameters directly from S-Parameters and a higher level of accuracy and granularity.

Keysight Technologies, Inc., participated in a first PCI Express® (PCIe®) 5.0 Preliminary FYI Workshop sponsored by PCI-SIG®, with solutions that simulate, characterize and validate PCIe 5.0 devices enabling Keysight to drive consistency in test standards that will advance innovation in hyperscale data centers, 5G and cloud computing. 

Raydiall and Yazaki, have developed a single pair ethernet (SPE) connector for 1000BASE-T1 in accordance with the OPEN Alliance TC9 specification. Rohde & Schwarz assisted Raydiall to verify the development and test compliance of such connectors with the use of a R&S ZNB8 4-port vector network analyzer.

A pair of industry experts will offer their popular and informative advice on how to avoid the most common design errors caught by fabrication when PCB East returns to the Boston area in June.

SnapEDA, creators of the first search engine for electronics design, and Labcenter Electronics, creators of Proteus Design Suite, announced a collaboration that places SnapEDA directly within Proteus’ printed circuit board (PCB) design environment. 

In response to the continuing challenges caused by the global pandemic, the organizers of EDI CON CHINA have decided to change the program for 2021 to ensure timely delivery of technical conference material to engineers across the country. Instead of a large in-person event this year, EDI CON CHINA 2021 will occur as EDI CON ACROSS CHINA 2021, which will include a virtual event paired with localized in-person conferences in two cities.

The two-day virtual event Electronic Design and Test Days 2021 organized by Rohde & Schwarz, will deliver the latest expertise from leading industry experts on high speed digital design and power electronics. Attendees will experience live keynotes and conference sessions, virtual exhibition and educational areas including a variety of subjects available on demand, and an interactive chat.