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Rohde & Schwarz now offers the R&S ZNH, a full two-port handheld vector network analyzer up to 26.5 GHz with cable and antenna analysis and full S-parameter measurements.

Pico Technology announced availability of the PicoScope 4000A Series PC-based oscilloscopes, a second-generation upgrade and expansion of the company's high-resolution, deep-memory product portfolio.

TraceParts and SnapEDA, are announcing a strategic content syndication partnership. The partnership helps electronics engineers and designers source PCB footprints, schematic symbols, and 3D CAD models at their fingertips, for millions of electronic components.

Teledyne e2v HiRel is adding two additional, ruggedized GaN power HEMTs (High Electron Mobility Transistors) to its 650-volt, high-power family of products based on GaN Systems technology.

CEVA, Inc. announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs.

Pixus Technologies, has provided the fastest known customized OpenVPX backplane/chassis design in the market.  The system was utilized in a military data center installation. 

Tower Semiconductor and Alpine Optoelectronics, inc, announced that Alpine Optoelectronics, Inc. began production of its 400G PAM4 nCP4™ optical engine on Tower Semiconductor’s PH18 Silicon Photonics technology platform.

Passive Plus, Inc.’s online Capacitor Application Program (C.A.P.) helps engineers and designers select capacitors according to parameters such as cap value and frequency.

AVX Corporation, has joined the OPEN (One-Pair Ethernet) Alliance, a non-profit special interest group (SIG) comprised of automotive industry and technology providers dedicated to encouraging the widespread adoption of single-pair ethernet solutions as the standard for automotive networking applications.

Rohde & Schwarz announced that the seventh edition of its Demystifying EMC conference will go virtual, offering participants the opportunity to engage with industry experts through Europe and beyond. In an expanded three-day digital event running from 9th to 11th February 2021, the conference will feature a mix of live, educational, and interactive events, with a virtual exhibition running alongside.