Signal Integrity

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MACOM Acquiring AppliedMicro for $770M

MACOM has entered into a definitive agreement to acquire AppliedMicro Circuits Corp. The acquisition, valued at approximately $770 million, allows MACOM to strengthen its portfolio for the data center market, adding OTN framers, MACsec Ethernet networking components and a single-lambda PAM4 platform.


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New Probe for Rohde & Schwarz Oscilloscopes Measures Voltages in the Millivolt Range

The new R&S RT-ZP1X passive 1:1 probe from Rohde & Schwarz broadens the application range of its R&S RTO and R&S RTE series oscilloscopes. Both the probe and the oscilloscopes' front-end are extremely low noise, making this combination ideal for measuring the smallest of signals down to 1 mV/div, e.g., for power integrity measurements on integrated circuits and components.


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ADI's High-Resolution, Low-Power SAR ADC Ensures Shorter Test and Development Times

Analog Devices Inc. announced a new generation of high-precision successive-approximation (SAR) analog-to-digital converters (ADCs) that uniquely combine the attributes of high performance, low power, small footprint and ease of use. These ICs enable mobile test and measurement instruments to operate for longer duration during field tests while improving measurement accuracy and repeatability. The new devices also support development of smaller-sized instruments, which can be placed closer to the sensors being measured, or allow for an increased number of data acquisition channels in the same form factor.


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Inphi Acquiring ClariPhy Communications, Adding Coherent DSP to Portfolio

Inphi Corp. has signed a definitive agreement to acquire ClariPhy Communications Inc. for $275 million in cash. ClariPhy provides ultra-high speed digital signal processing (DSP) systems-on-chip (SoC) for multi-terabit data, long haul and metro networks. This DSP capability complements Inphi’s fiber optic components, which will enable Inphi to offer more of the block diagram for optical networks.


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CUI

New Line of USB 2.0 and 3.0 Connectors Expands CUI’s Interconnect Portfolio

CUI’s Components Group today announced an expansion to its existing portfolio of power, audio and signal connectors with the addition of a USB product line. The new connector family incorporates USB 2.0 and 3.0 connectors available in Type A, Type B, Micro AB, Micro B, Mini AB and Mini B USB versions. Able to support data rates up to 5 Gbps in USB 3.0 models, the new product family is ideal for a variety of I/O applications in consumer and portable electronic devices, including mobile computing equipment, digital audio devices and high volume storage products.


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