Molex has introduced its External Laser Source Interconnect System (ELSIS), a complete system of cage, optical and electrical connectors with a pluggable module that uses proven technology to speed development of hyperscale data centers.
Molex, announces the expansion of its industry-leading NearStack High-Speed Cable Solutions to include the NearStack 100 Ohm and NearStack 85 Ohm solutions. The extended portfolio helps organizations manage costs, reduce insertion loss, and improve signal integrity.
Molex, a global provider of integrated electronic products, will showcase high-speed data connectivity solutions at DesignCon 2017 in Santa Clara, CA, February 1-2, 2017. Molex booth 619 will feature next-generation technologies designed to meet rising data speeds and bandwidth in demanding networking and high performance computing applications.
Molex LLC and TE Connectivity (TE) will collaborate on the launch and promotion of select new connector and cable assembly products that enable the growing number of high-speed applications required as data centers evolve with hyperscale models and increased virtualization. The DSA will support today’s data speeds and up to 56 Gbps and beyond. The scope of the agreement includes next-generation connector products, and the DSA is intended to build on the successful history with standard second source agreements for products such as: zSFP+ interconnects, zQSFP+ interconnects, CDFP interconnects, microQSFP interconnects, and Nano-Pitch I/O interconnects.