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Molex has introduced its External Laser Source Interconnect System (ELSIS), a complete system of cage, optical and electrical connectors with a pluggable module that uses proven technology to speed development of hyperscale data centers.

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Molex and TE Connectivity Collaborate on Next-Gen Data Communications Electronic Products

Molex LLC and TE Connectivity (TE) will collaborate on the launch and promotion of select new connector and cable assembly products that enable the growing number of high-speed applications required as data centers evolve with hyperscale models and increased virtualization. The DSA will support today’s data speeds and up to 56 Gbps and beyond. The scope of the agreement includes next-generation connector products, and the DSA is intended to build on the successful history with standard second source agreements for products such as: zSFP+ interconnects, zQSFP+ interconnects, CDFP interconnects, microQSFP interconnects, and Nano-Pitch I/O interconnects.

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