It has been a year and a half since we last met in person for DesignCon 2020, and the event organizers are aiming to make the in-person experience of DesignCon 2021 in California as compelling as possible, offering live technical paper sessions, tutorials, industry panels, product demos, and exhibits at the San Jose McEnery Convention Center August 16-18, 2021.
DesignCon 2021 is co-located with Drive World and ESC, with the DesignCon all access pass and 2-day conference pass both providing access to DriveWorld/ESC’s eight tracks. (Attendees can also opt for a Drive World + ESC pass, which does not provide access to DesignCon sessions.) Expo passes continue to be free. (More information here.) Drive World+ESC technical sessions focus on automotive electronics and intelligence and embedded hardware, software, and IoT.
This year’s event takes place in San Jose, a departure from the long-term home of DesignCon at the Santa Clara Convention Center. Event organizers chose this location for its space and safety record. Group Event Director, Suzanne Deffree explains, “DesignCon proactively moved to the Global Biorisk Advisory Council (GBAC) STAR accredited San Jose McEnery Convention Center for its 2021 event, anticipating the need for more space. We decidedly secured the full venue. Doing so allows DesignCon more control over who is in the building, what protocols are enacted, and provides the space to allow attendees to gather, network, and collaborate not only during our traditional conference and expo, but for the gatherings our DesignCon community looks forward to every year, like our Welcome Reception, aptly themed as a Family Reunion this year” (see more information on the event’s health and safety protocols).
Some favorite highlights, the Engineer of the Year and Best Paper Awards will be presented Tuesday 17 August, at 9:50-10:20AM, just before the keynote. The technical program can be accessed here. The exhibition is open Tuesday and Wednesday 17-18 August from 11:00AM – 6:00PM. Event organizers expect approximately 100 exhibitors to attend. Some are featured below:
Amphenol SV Microwave
Booth #: 530
Amphenol SV Microwave is a world leader in the RF/Microwave industry with over 50 years of proven performance for the military, satellite, aerospace, commercial and telecommunications markets. When it comes to the design and manufacture of high frequency, high-reliability interconnects, Amphenol SV Microwave has set the standard in RF and microwave connectors, adapters, components and cable assemblies.
Carlisle Interconnect Technologies
Carlisle Interconnect Technologies (CarlisleIT) offers a wide portfolio of low-loss, high-frequency precision RF connectors in vertical, edge, and panel mount configurations to give you design flexibility in your application. The 1.0 mm and 1.35 mm connector series are our latest additions. We have qualified solderless edge and vertical types compatible with microstrip and grounded coplanar microwave circuits. Operating over a frequency range of DC -110 GHz, the new 1.00 mm RF connectors offer excellent signal integrity with high reliability and minimal loss.
CarlisleIT also offers solutions for space-conscious edge launch applications with our narrow-body edge-launch configuration that requires about 50% less width compared to standard edge-launch connectors. We also offer our 30º Angled Precision RF Connectors, where it becomes possible to launch RF signals to and from a trace with limited vertical clearance, thereby extending the life and reliability of the associated cable assembly.
Booth # 930
HUBER+SUHNER delivers an extensive range of high quality components specifically designed to meet the various requirements of test and measurement applications. We offer a wide range of highly flexible yet supremely rugged cable assemblies with excellent amplitude and phase stability and high-precision connectors, as well as terminations and adapters. Because the best measurement system is only as good as its weakest link, it’s critical to select the right components specifically suited to your particular system.
And while HUBER+SUHNER offers an extensive product line of cables, connectors and adaptors, we also understand that some application needs are unique. This is why we offer custom-engineered solutions through innovative design, using state-of-the-art development tools. Our in-house type testing capabilities will further prove the design through intensive verification tests according to MIL standards or your specific requirements.
Booth #: 807
High-speed digital standards are quickly evolving to keep pace with emerging technologies. Each generational change introduces new test challenges for digital designs. Customers need to test high-speed digital designs across all product development stages — from design and simulation, analysis, debug, to compliance test. Keysight can help to anticipate test challenges, optimize performance, and accelerate time-to-market of high-speed computing interfaces, data center connections, and consumer electronics.
Join Keysight, the DesignCon 2021 host sponsor, at Booth 807 to understand how Keysight can help to anticipate test challenges, optimize performance, and accelerate time-to-market. On Tuesday, August 17th, visit the Chiphead Theatre from 2:15 to 3:00 p.m. for Keysight’s Modernization of Test and Measurement technical session.
LANGER EMV-Technik GmbH
Booth # 214
Langer EMV-Technik is in the forefront of research, development, and production in the field of EMC. Through EMC experimental seminars and EMC workshops we offer our comprehensive knowledge to our customers. Our interference emission and interference immunity EMC measurement technology as well as the IC test system are used mainly in the development stage and are in worldwide demand.
Developers and designers gain new perspectives and more efficient working strategies for module- and IC developments with the EMC know how and measurement technology of Langer EMV-Technik GmbH. The individual pre-compliance consulting services provided by Langer EMV-Technik GmbH help developers and designers quickly find solutions to complex EMC problems in IC, device, and module development.
We make both our comprehensive EMC expertise and research results available to our customers via practical experimental EMC seminars and in-house events .
Booth # 319
Rogers’ Advanced Electronics Solutions (AES) business delivers advanced material solutions to solve design issues such as signal integrity, Radio Frequency (RF) signal management, power efficiency, power distribution, and thermal management, to deliver improve device and system reliability. These solutions include high frequency laminates, bondplys, prepregs, cooling solutions, ceramic substrates and busbars. Headquartered in Chandler, Arizona, Rogers operates manufacturing facilities in the United States, Asia and Europe, with sales offices worldwide.
Rohde & Schwarz
Booth # 607
At DesignCon this year Rohde & Schwarz will be introducing our all-new R&S®RTO6 oscilloscope. Featuring a fresh new user interface on a larger, 15.6-inch Full HD touchscreen and straightforward workflows, it speeds up daily measurement tasks. The R&S RTO6 delivers deep insights into designs on the engineer's workbench with state-of-the-art specifications such as an outstanding 9.4 ENOB, an unparalleled update rate of one million waveforms per second as well as a comprehensive toolset of analysis functions.
In addition, Rohde & Schwarz will be showing the R&S ZNA high-end vector network analyzer (VNA) which now features models with 50 GHz and 67 GHz maximum frequencies. This opens up the VNA’s outstanding RF performance, unique hardware concept and innovative touch operation to new areas of application. Signal integrity measurements as well as A&D and 5G component and module characterization are main applications for the new analyzer models.
Booth # 907
Samtec’s innovative silicon-to-silicon connector solutions exceed standard connectivity demands. New architectures require massive increases in transmission speeds, bandwidths, frequencies and densities. Samtec is addressing these challenges with a broad line of signal integrity optimized, high-performance interconnect and technology solutions, along with the highest level of expertise in the industry. At DesignCon, Samtec will showcase several new cutting-edge products and technologies, including 112 Gbps PAM4 systems.
Samtec is a $900 MM global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, and precision RF products. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service.
Booth # 1030
SIGLENT will be showcasing our newest test and measurement products, including our new multiport VNAs and flagship scope series. Stop by, talk with our applications engineers and find out why SIGLENT is the best value in test and measurement!