Ted Ballou

Ted Ballou is a Signal Integrity Engineer at Samtec and previously at Intel, working with high speed PCB
interconnects and serial interfaces.

ARTICLES

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112 Gbps PAM4 Silicon and Connector Evaluation Platform

The continued progression to higher data rates puts increasing demands on the design of practical SerDes channels. At 112G-PAM4, the UI is only 17.86 ps, and signal transmission in the PCB must be highly optimized for loss, reflections, crosstalk, and power integrity. This article summarizes the key elements of a study that describes the signal-integrity and power-integrity design process and shows simulated SI and PI performance correlated to measured data as well as measured eye diagrams of a test board that uses a 112G-capable silicon and high-speed compression-mount cable connectors. 


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