ARTICLES

Samtec Microelectronics

IC Package_DC_PrintSamtec Microelectronics provides complex package assembly, including precision die attach and ultra-fine pitch wirebond, for a variety of traditional and glass substrates, with expertise in packaging and substrate design, stacked die and multi-chip modules.


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Signal Integrity Group / Teraspeed® Consulting

electrical_optimized_eyepattern-2The Signal Integrity Group provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, and application-specific design and development assistance.  Teraspeed® Consulting offers Tier 1 level signal integrity expertise and capabilities delivered directly to your engineering team.


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FireFly™ / Samtec Optical Group

Samtec FireFlyThe FireFly™ Micro Flyover System™ gives designers the flexibility of using micro footprint optical and copper interconnects interchangeably with the same connector system. The Industry-leading miniature footprint allows for higher density close to data source.  The data “flies” over lossy PCB for up to 28 Gbps per lane. 


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High-Speed Cable Assemblies

Samtec High Speed CableHigh-speed cable assemblies are available with 50 Ω ribbonized coax cable, or differential 100 Ω twinax cable.  Assemblies include high-density arrays, systems with integral ground planes, hermaphroditic, rugged Edge Rate®, high-speed PCI Express® systems, and future-proof assemblies to design-in copper with the ability to upgrade to optical with the same PCB interconnects. 


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High-Speed Mezzanine

Samtec High Speed B-BHigh-speed board-to-board systems are rated at 28+ Gbps and come in a variety of design options, including low profile Q-Strip® interconnect systems with an integral ground/power plane, available in 0.50, 0.635, and 0.80 mm pitch.  Q2™ is a rugged system with increased insertion depth for rugged applications.  Edge Rate® strips incorporate rugged Edge Rate Contacts which are  less prone to damage when zippered during unmating. 


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High-Density Arrays

Samtec ArraysSamtec High-Density Arrays are designed to maximize density, bandwidth, and routing flexibility.  Popular SEARAY™ interconnects are available with up to 500 I/Os or 125 differential pairs.  The rugged Edge Rate® contact system is less prone to damage when zippered during unmating.  The SEARAY .8mm  system is 2x the density of standard SEARAY.


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