As a global leader in signal integrity, Samtec’s in-house engineering team utilizes EDA tools across the industry via our global 24/7 support of customer SI designs and applications. Our experience with these tools enables unique collaborations with EDA suppliers and industry leading technical events.
Samtec, a privately held $662MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the Consortium for On Board Optics (COBO) has adopted a two-piece surface mount connector system based on Samtec’s FireFly™ Micro Flyover System™ for the next generation of standardized on-board optical modules.
Samtec Microelectronics provides complex package assembly, including precision die attach and ultra-fine pitch wirebond, for a variety of traditional and glass substrates, with expertise in packaging and substrate design, stacked die and multi-chip modules.
The Signal Integrity Group provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, and application-specific design and development assistance. Teraspeed® Consulting offers Tier 1 level signal integrity expertise and capabilities delivered directly to your engineering team.
The FireFly™ Micro Flyover System™ gives designers the flexibility of using micro footprint optical and copper interconnects interchangeably with the same connector system. The Industry-leading miniature footprint allows for higher density close to data source. The data “flies” over lossy PCB for up to 28 Gbps per lane.
High-speed cable assemblies are available with 50 Ω ribbonized coax cable, or differential 100 Ω twinax cable. Assemblies include high-density arrays, systems with integral ground planes, hermaphroditic, rugged Edge Rate®, high-speed PCI Express® systems, and future-proof assemblies to design-in copper with the ability to upgrade to optical with the same PCB interconnects.
High-speed board-to-board systems are rated at 28+ Gbps and come in a variety of design options, including low profile Q-Strip® interconnect systems with an integral ground/power plane, available in 0.50, 0.635, and 0.80 mm pitch. Q2™ is a rugged system with increased insertion depth for rugged applications. Edge Rate® strips incorporate rugged Edge Rate Contacts which are less prone to damage when zippered during unmating.
Samtec High-Density Arrays are designed to maximize density, bandwidth, and routing flexibility. Popular SEARAY™ interconnects are available with up to 500 I/Os or 125 differential pairs. The rugged Edge Rate® contact system is less prone to damage when zippered during unmating. The SEARAY .8mm system is 2x the density of standard SEARAY.