Samtec Microelectronics

IC Package_DC_PrintSamtec Microelectronics provides complex package assembly, including precision die attach and ultra-fine pitch wirebond, for a variety of traditional and glass substrates, with expertise in packaging and substrate design, stacked die and multi-chip modules.

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Signal Integrity Group / Teraspeed® Consulting

electrical_optimized_eyepattern-2The Signal Integrity Group provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, and application-specific design and development assistance.  Teraspeed® Consulting offers Tier 1 level signal integrity expertise and capabilities delivered directly to your engineering team.

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