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Bert Simonovich explains why you should take your shot at becoming an industry influencer, offering tips to get started and to keep moving.

Check out this description of what is likely the fastest GaN edge-speed ever recorded.

It turns out that dielectrics, in fact, cool traces more efficiently than does convection + radiation, and therefore internal traces are relatively cooler. In this article, Brooks & Adam examine the question: Is there a predictable relationship between the external temperature of a trace and the internal temperature of the same trace carrying the same current?

Many designs today include three different value decoupling capacitors, or when using just one capacitor, a small value like 0.1 uF. These recommendations are based on 50-year-old assumptions that do not apply today. It is time to reconsider these out of date, legacy design guidelines.

Copper loss is one ingredient in interconnect loss. Surface texture or roughness has long been recognized as adding an excess loss over smooth copper. With the SI-VSP (very smooth profile) copper foils recently introduced by Mitsui Mining&Smelting Co. Ltd. (Mitsui Kinzoku), we may have reached the limits.

Low-speed printed circuit board (PCB) designs now have to deal with high-speed switching problems. This article examines the ground bounce generated from an LCD assembly while evaluating the impact of the ground bounce on the system level EMI. Three solution strategies to mitigate the ground bounce are analyzed, the pros and cons of each strategy are provided along with the test results.

Automotive design has captured the public’s imagination, and their expectations are creating countless technical challenges for engineers working in this space. For SI/PI/EMC/EMI engineers, the challenges are unique inside the car due to harsh environments as well as crowded systems.

Eagerly anticipated, the next generation of DRAM technologies (DDR5/LPDDR5) are presently being validated in the lab by leading silicon vendors worldwide. This latest generation has a big surprise in store for hardware engineers and SI specialists that need to simulate such systems. DDR5 will introduce decision feedback equalization (DFE) for the DRAM receiver for the very first time.

Here’s a roundup of some of the things taking place at DesignCon 2020.

Watch out for those operating frequencies. Here are some tips to avoid EMC emission test failures.