Pat parlayed his engineering background into a management role in marketing communications for several leading semiconductor vendors. Currently, he is a contributing editor to Signal Integrity Journal as well as serving as Editor for Microwave Journal, where he sets MWJ’s editorial direction and develops market opportunities.
DesignCon highlighted the latest in high-speed digital design with keynotes covering the hot topics in the industry such as quantum computing, 5G, and artificial intelligence. Read this review of the event and exhibition.
eSilicon was in the Samtec booth at DesignCon 2019 presenting their collaboration with Wild River Technology to develop an advanced test system that addresses the difficult signal integrity demands of 56/112G PAM4 operation. The test system design utilizes the upcoming IEEE P370 standard in association with compliance metrics 802.3bs, OIF CEI – 56G PAM4, and COBO to validate the required performance.
The 2018 IEEE EMC+SIPI event returned to Long Beach, CA after last visiting in 2011. The event continues to include Signal Integrity & Power Integrity (SIPI) as part of the conference, reflecting the EMC Society’s influence and focus on this critical topic of engineering design.
DesignCon 2018 featured a 14-track conference covering the latest developments in hardware and high-speed communications design with over 100 technical sessions, three full day boot-camps, and more. Read this full review of the new products introduced at the event.
DesignCon 2018 will feature a 14-track conference covering the latest developments in hardware and high-speed communications design. The conference will also have over 100 technical sessions, three full day boot-camps, and more. Signal Integrity Journal has collected the following exhibition highlights as a preview to what you will see in the exhibition hall.
As rated by reader views, here are the Top 10 Articles on Signal Integrity Journal for 2017. Thank you for your readership in 2017, and we look forward to bringing you many more great technical features in 2018!
The 60th IEEE EMC SI/PI Symposium took place August 7-11 at National Harbor in Washington DC with the “plan to inspire, envision, and innovate.” The keynote set the stage for this plan as Julius Knapp, FCC Chief of the Office of Engineering and Technology, discussed the status of the FCC and industry EMC standards, the equipment authorization program and enforcement as the wireless space becomes more and more crowded with emerging technologies such as IoT, connected/autonomous vehicles, UAVs, increased satellite broadband and 5G taking off.