Patrick Hindle

Patrick Hindle

Pat parlayed his engineering background into a management role in marketing communications for several leading semiconductor vendors. Currently, he is a contributing editor to Signal Integrity Journal as well as serving as Editor for Microwave Journal, where he sets MWJ’s editorial direction and develops market opportunities.

ARTICLES

EDI CON China 2019 Event Summary

7th Annual Electronic Design Innovation Conference covering RF/microwave, EMC/EMI and SI/PI

EDI CON China 2019 returned to Beijing and the Chinese National Convention Center (CNCC) April 1-3 with an exhibition of 100 industry-leading companies as well as a technical conference that included 2 and a half days of technical presentations, workshops, panels and featured keynote talks.


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Test System Addresses Demands of 56/112G PAM4 Using Upcoming IEEE P370 Standard

eSilicon was in the Samtec booth at DesignCon 2019 presenting their collaboration with Wild River Technology to develop an advanced test system that addresses the difficult signal integrity demands of 56/112G PAM4 operation. The test system design utilizes the upcoming IEEE P370 standard in association with compliance metrics 802.3bs, OIF CEI – 56G PAM4, and COBO to validate the required performance.


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IEEE EMC+SIPI 2018 Exhibition Summary

The 2018 IEEE EMC+SIPI event returned to Long Beach, CA after last visiting in 2011. The event continues to include Signal Integrity & Power Integrity (SIPI) as part of the conference, reflecting the EMC Society’s influence and focus on this critical topic of engineering design.


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DesignCon 2018 Preview

DesignCon 2018 will feature a 14-track conference covering the latest developments in hardware and high-speed communications design. The conference will also have over 100 technical sessions, three full day boot-camps, and more. Signal Integrity Journal has collected the following exhibition highlights as a preview to what you will see in the exhibition hall.


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