Patrick Hindle

Patrick Hindle

Pat parlayed his engineering background into a management role in marketing communications for several leading semiconductor vendors. Currently, he is a contributing editor to Signal Integrity Journal as well as serving as Editor for Microwave Journal, where he sets MWJ’s editorial direction and develops market opportunities.

ARTICLES

IEEE EMC+SIPI 2018 Exhibition Summary

The 2018 IEEE EMC+SIPI event returned to Long Beach, CA after last visiting in 2011. The event continues to include Signal Integrity & Power Integrity (SIPI) as part of the conference, reflecting the EMC Society’s influence and focus on this critical topic of engineering design.


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DesignCon 2018 Preview

DesignCon 2018 will feature a 14-track conference covering the latest developments in hardware and high-speed communications design. The conference will also have over 100 technical sessions, three full day boot-camps, and more. Signal Integrity Journal has collected the following exhibition highlights as a preview to what you will see in the exhibition hall.


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EMC in the Capital

IEEE EMC SI/PI 2017 Summary

The 60th IEEE EMC SI/PI Symposium took place August 7-11 at National Harbor in Washington DC with the “plan to inspire, envision, and innovate.” The keynote set the stage for this plan as Julius Knapp, FCC Chief of the Office of Engineering and Technology, discussed the status of the FCC and industry EMC standards, the equipment authorization program and enforcement as the wireless space becomes more and more crowded with emerging technologies such as IoT, connected/autonomous vehicles, UAVs, increased satellite broadband and 5G taking off.


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Engineer What’s Next – NIWeek 2017

This is the first year that NIWeek has taken place in late May instead of its normal early August time slot and switches permanently to this part of the calendar. NIWeek 2017 kicked off with new CEO Alex Davern paying tribute to Dr. T with a standing ovation from the audience. Read this summary of what happened at NIWeek 2017.


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