When Frequency Shapes Time: How S-Parameter Properties Shape Simulated TDR Behavior

Thu, 14 May 2026 00:00:00 -0400

Machine Learning Models for SI/PI Analysis with Meshed Planes

Wed, 13 May 2026 00:00:00 -0400

IMS2026: The RF and Microwave Event Comes to Boston, June 7–12

Tue, 12 May 2026 00:00:00 -0400

The 2026 IEEE International MTT Symposia (IMS2026) convenes 7-12 June 2026 at the Thomas M. Menino Convention and Exhibition Center (MCEC), bringing 500+ exhibiting companies and more than 8,000 engineers, researchers, academics, and technology leaders from around the world to Boston.

Evolution of the PDN Design Process: Explaining the Second Paradigm Shift

Mon, 11 May 2026 00:00:00 -0400

Infineon Collaborates with d-Matrix to Optimize Performance and Power Efficiency for Interactive AI Inferencing

Sun, 10 May 2026 00:00:00 -0400

Infineon Technologies AG announced a collaboration with d-Matrix^®, a pioneer in highly interactive, low-latency AI inference compute for data centers.

SIJ Publishes April 2026 Issue

Sat, 09 May 2026 00:00:59 -0400

Signal Integrity Journal, covering signal integrity, power integrity and EMC/EMI, has published its April 2026 issue. Don't miss out on the latest. Download now!

AI-Assisted HFSS Modeling For 100 GHz+ High-Speed Interconnect Design

Tue, 21 Apr 2026 00:00:00 -0400

Why Power Architectures Constrain New Space AI Missions

Mon, 20 Apr 2026 00:00:00 -0400

Rohde & Schwarz to Host Power Electronics Online Conference “From Design to Validation” in May

Sun, 19 Apr 2026 00:00:27 -0400

Rohde & Schwarz will host the Power Electronics Online Conference “From Design to Validation” on May 5 and 6, 2026.

Mitigating Ground Loop Errors in High-Current PDN Measurements: Validating Measurement Accuracy Across Oscilloscope Platforms

Mon, 16 Mar 2026 01:00:00 -0400

As currents increase and voltage rails shrink, managing fluctuations becomes a critical challenge. While probe noise is a major factor, the common-mode noise induced by the ground loop between the high-current DUT and the oscilloscope is often the more dominant disruptor in high-current AI environments. This experiment proves that simply switching oscilloscope vendors will not solve the problem. Read on to learn why the solution lies in the probing chain.

Siemens Acquires DownStream Technologies to Expand PCB Design-to-Manufacturing Flow

Tue, 08 Apr 2025 00:00:25 -0400

Siemens Digital Industries Software announced that it has completed the acquisition of DownStream Technologies. This acquisition strengthens Siemens’ PCB design portfolio and expands its footprint in the electronics small and medium-sized business market.

Türk Telekom and ZTE Complete World's First 1.6T with 12 THz Bandwidth DWDM Trial on Live Network

Thu, 03 Apr 2025 00:00:28 -0400

The trial successfully transmitted ultra-fast 800GE/400GE services, laying a solid foundation for the upcoming large-scale deployment of 5G networks, supporting the digital transformation of industries in Türkiye.

DustPhotonics Expands Silicon Photonics Portfolio with 2xFR4 Products for AI and Hyperscale Data Centers

Wed, 02 Apr 2025 00:00:50 -0400

Designed for AI workloads and hyperscale data center environments, the new 1.6T and 800G PICs enable breakthrough levels of performance, density, and power efficiency.

Junkosha Reveals New Look for Third Technology Innovator of the Year Award

Mon, 31 Mar 2025 00:00:56 -0400

Junkosha launched its new look for its third Technology Innovator of the Year Award.

Rohde & Schwarz Presents Comprehensive R&S ELEKTRA Portfolio for EMC Measurements

Sat, 29 Mar 2025 00:00:50 -0400

Rohde & Schwarz continues to develop its R&S ELEKTRA EMC test software by adding new measurement methods, adapting it to new standards and ensuring that users can carry out measurement tasks even more efficiently.

Created by Engineers, for Engineers: DesignCon Celebrates 30 Years

Sun, 26 Jan 2025 00:00:00 -0500

DesignCon gears up to celebrate its 30th anniversary this January with special events, an expo full of leading suppliers, and its highly regarded education.

The Need for Speed and the Cost in Power

Sun, 12 Jan 2025 00:00:00 -0500

The need for speed will be the driving force behind energy production and efforts to make increasingly efficient use of available energy. Eric Bogatin reflects upon the evolution of power resources from the Industrial Revolution to today’s generation of AI and network processors.

SiTime Precision Timing Enables New Architectures for More Efficient AI Datacenters

Fri, 10 Jan 2025 00:00:44 -0500

SiTime announces the differential-ended SiT5977 Super-TCXO, the only single-chip timing solution that delivers the most resilient performance for AI compute-nodes with high bandwidth and network synchronization.

Liquid Cooling and Increasing TDPs: IDTechEx Explores Thermal Management for Data Centers

Fri, 20 Dec 2024 09:57:08 -0500

IDTechEx reports that the data center liquid cooling market could see a six-fold size expansion over the next 10 years.

Signal Edge Solutions Founder Nominated for Prestigious DesignCon 2025 Engineer of the Year Award

Thu, 19 Dec 2024 17:38:27 -0500

Signal Edge Solutions, a leading provider of signal and power integrity engineering solutions, is delighted to share that Benjamin Dannan, the company’s founder and chief technologist, is a finalist for the prestigious DesignCon 2025 Engineer of the Year Award.

Arteria and Nokia Set Optical Transmission Record of 1 Tbps Between Lyon and Toulouse

Thu, 19 Dec 2024 17:25:09 -0500

Arteria and Nokia achieve a groundbreaking 1 Tbps optical transmission milestone between Lyon and Toulouse, leveraging VIAVI’s cutting-edge ONE LabPro™ solutions to ensure seamless performance and scalability for future-ready connectivity.

Sivers Semiconductors and Ayar Labs to Expand Their Partnership on Enabling High Volume Manufacturing of Optical I/O Solutions for Scalable Cost-Effective AI Infrastructure

Thu, 19 Dec 2024 11:48:40 -0500

Sivers Semiconductors AB is in advanced discussions with its strategic customer, Ayar Labs, to partner on the next phase of engagement focused on manufacturing at scale to support deployment of Ayar labs in-package optical interconnect solutions.

Coming Soon to Langer EMV-Technik GmbH: ICI-DP Sets and TroubleStar

Wed, 18 Dec 2024 00:00:47 -0500

Langer EMV-Technik GmbH shares information about new ICI-DP Sets and TroubleStar.

Menlo Micro Welcomes Under Secretary of Defense, Heidi Shyu, to Irvine, Calif., Headquarters

Tue, 17 Dec 2024 00:00:55 -0500

Menlo Micro welcomed Under Secretary of Defense for Research and Engineering Heidi Shyu to Menlo Micro’s headquarters to discuss the widespread applications of its technology and the company’s continued work with the Department of Defense (DOD).

Measuring Battery Impedance

Thu, 21 Nov 2024 00:00:00 -0500

In this article, Steve Sandler presents several methods of measuring battery impedance, discussing the reasons for conducting such measurements and the challenges one might encounter along the way.

Infineon and Quantinuum Announce Partnership to Accelerate Quantum Computing

Wed, 20 Nov 2024 00:00:50 -0500

Infineon Technologies AG and Quantinuum announced a strategic partnership to develop the future generation of ion traps.

Samtec AcceleRate Slim Cable Assemblies Save PCB Space, Support PCIe 6.0/CXL 3.1

Tue, 19 Nov 2024 00:00:53 -0500

Available now in production quantities, Samtec AcceleRate Slim Direct-Attach Cable Assemblies target high-density applications in computing, datacom, AI, and shielded Gigabit Ethernet designs.

Cadence Transforms Chiplet Technology with First Arm-Based System Chiplet

Sun, 17 Nov 2024 00:00:17 -0500

Cadence has achieved a significant milestone by designing and taping out its first-ever system chiplet, marking a groundbreaking advancement in chiplet realization capabilities.

Siemens Unveils Next Generation AI-Enhanced Electronic Systems Design Software

Sat, 09 Nov 2024 00:00:37 -0500

Latest release combines Xpedition, Hyperlynx, and PADS Professional software through unified user experience with cloud connectivity and collaboration.

Samtec Shipping Ultra Low, 2 mm Stack Height Printed Circuit Board to Board Connectors at 28 Gbps NRZ Performance

Tue, 29 Oct 2024 00:00:15 -0400

SLH/TLH PCB board-to-board connectors are part of Samtec’s Ultra Micro line of products that maximize overall space and offer reliable connections in high data rate rugged environments such as automotive, industrial IOT, robotics, and military and aerospace.

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