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BER- and COM-Way of Channel-Compliance Evaluation: What are the Sources of Differences?

We analyze the computational procedure specified for Channel Operation Margin (COM) and compare it to traditional statistical eye/BER analysis. There are a number of differences between the two approaches, ranging from how they perform channel characterization, to how they consider Tx and Rx noise and apply termination, to the differences between numerical procedures employed to convert given jitter and crosstalk responses into the vertical distribution characterizing eye diagrams and BER. We show that depending on the channel COM may potentially overestimate the effect of crosstalk and, depending on a number of factors, over- or underestimate the effect of transmit jitter, especially when the channel operates at the rate limits. We propose a modification to the COM procedure that eliminates these problems without considerable work increase.


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Ensuring High Signal Quality in PCIe Gen3 Channels

The increased data rates of today’s high-speed Input/Output (I/O) buses make maintaining transmission channel signal quality all the more challenging. One reason for the challenge is the parasitic effects that result from bus interconnects. Over the past decade, data rates for electrical interconnects have experienced a dramatic increase—from 1 Gbps to 25 Gbps and beyond—to meet the ever increasing demand for more I/O bandwidth from modern networking applications and high-capacity storage.


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Via Stubs – Are They all Bad?

We worry about via stubs in high-speed designs because they cause unwanted resonant frequency nulls which appear in the insertion loss plot (IL) of the channel. But are all via stubs bad? Well, as with most answers relating to signal integrity, “It depends.”


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EDI CON USA Announces 2017 Event: Save the Date!

Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity and EMI/EMC products. 


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