Featured Stories

RSS

IDTechEx explores the opportunities and challenges for QRNG in the growing connected devices and quantum communications markets.

Available freely to Samtec customers under NDA, SIBORG works with Ansys HFSS 3D Layout to generate, visualize, optimize, and develop PCB package and component break out regions.

At the heart of Bridge12's next-generation EPR spectrometer is a pair of Spectrum Instrumentation cards. 

Artificial intelligence-generated content is rewriting the rules for data center networks, driving a need for extreme throughput and density at unprecedented scales. To meet these requirements, hyperscalers need high-performance 800G network solutions as quickly as vendors can deliver them.

Signal Integrity Journal, covering signal integrity, power integrity and EMC/EMI, has published its 2024 issue. Don't miss out on the latest. Download now!

The wireless telecommunications industry witnessed a year of unprecedented growth and innovation, propelled by the unstoppable momentum of 5G technology. 

In recent years, the IEEE Electrical Packaging Society technical committee for electrical design, modeling, and simulation recognized the need for open-source benchmarks for the simulation tool, verification, and test and measurement solution vendors. The intention is to overcome the obstacles that developers and users of such tools and instruments often encounter and create a growing library of benchmark cases for signal and power integrity challenges. As of October 2023, there are four published benchmark cases in the repository. This article describes a proposal for a fifth benchmark.

In the second part of this article series on navigating signal integrity challenges, Abhijit Wander showcases a marked improvement in signal integrity performance, specifically in connector-only scenarios, by transitioning from a microstrip to a stripline footprint design.

As PCIe technology continues to evolve to meet high bandwidth demands, the PCIe 7.0 architecture will focus on channel parameters and reach while improving power efficiency.