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Modern AI and datacenter systems, equipped with complex multi-domain Power Distribution Networks (PDNs), grapple with substantial challenges stemming from large-signal crosstalk and ground bounce.
Samtec, Inc., the service leader in the connector industry, will be demonstrating next-generation, high performance optical and copper interconnect solutions in booth #2004 at the upcoming ECOC exhibition.
The rapid growth in Data Centers, AI, and supercomputing demands significantly faster edge rates at the package and PCB levels, necessitating superior power delivery network (PDN) solutions.
According to Growth Market Report, the global Signal Integrity Monitoring for Vehicles market size reached USD 2.00 billion in 2025, driven by rapid advancements in automotive electronics and the increasing complexity of vehicle communication networks.
Designed for AI workloads and hyperscale data center environments, the new 1.6T and 800G PICs enable breakthrough levels of performance, density, and power efficiency.
Rohde & Schwarz continues to develop its R&S ELEKTRA EMC test software by adding new measurement methods, adapting it to new standards and ensuring that users can carry out measurement tasks even more efficiently.
DesignCon gears up to celebrate its 30th anniversary this January with special events, an expo full of leading suppliers, and its highly regarded education.
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