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Engineers invest tens to hundreds of thousands of dollars in signal integrity simulation software—the goal being to gain an accurate understanding of how signals are going to behave in the final product. But how do you do that early in the design process without reliable, verifiable electrical properties for the dielectrics incorporated into your design?

When starting a new project, board designers are often overwhelmed when trying to choose appropriate diff pair geometry, board material, and stackup to meet high-speed serial link loss budgets. Part of the printed circuit board (PCB) interconnect challenge is modeling transmission lines accurately. 

What is special about a material like PTFE that gives it such a low Dk and Df, while an epoxy has such a high Dk and Df? It is all about the chemical structure of the molecules and how they interact. Understanding the connection between chemistry and electrical properties is the starting place to engineer optimized materials for high-speed interconnects.

One reason I enjoy attending a conference is the opportunity to browse presentations I would not ordinarily see. I always pick up something new and useful. Here are some from my recent visit to the IEEE EMC Symposium.

An increasing number of manufacturers are adding or retrofitting wireless technology into new or existing products. These products typically include mobile, household, industrial, scientific, and medical (ISM) devices. This transition towards “everything wireless” is in full swing, and with it comes problems with electromagnetic interference (EMI) from the product itself interfering with sensitive on-board cellular, GPS/GNSS, and Wi-Fi/Bluetooth receivers. Read on to find out what to do about it.

SIJ had the opportunity to engage with Larry Williams, ANSYS director of technology, to find out his thoughts on how modeling and simulation needs have changed, how the industry has responded, and what’s next. At ANSYS, Larry Williams is responsible for the strategic direction of the company’s physics simulation products.

EDI CON Online, a new interactive event being held online September 10-12, 2019, has opened registration for its three days of tracks: 5G/IoT (September 10), Radar/Antenna (September 11) and Signal Integrity/Power Integrity (September 12), with EMC/EMI topics spread throughout the tracks.

One decision launched Todd Hubing on his current career path and has had a profound impact on the direction the EMC industry has taken over the last 35 years. Here's a summary of my interview with Todd.

On the first day of the 2019 IEEE EMC Symposium, Louann Mlekodaj, Eriko Yamato, Patrick DeRoy and other members of the EMC YP committee organized a Jeopardy game for the Young Professionals Group. As fitting the format of the Jeopardy show at an EMC event, answer categories covered, of course, EMC, SI and PI topics. Read on to test yourself!

The 2019 IEEE International Symposium on EMC and Signal/Power Integrity (EMC+SIPI) was held in New Orleans for the first time in our 50+ year EMC Society history taking place July 22-26. Read this review of the event.