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We searched for a superior cable for PDN measurements, then decided to create our own. Here’s the story.

Want to know more about the impedance and the encoding schemes adopted by prevailing high-speed I/O (HSIO) standards including PCIe, USB, Thunderbolt, and Ethernet? By looking back at the history of standards, some interesting trends and possible future directions are revealed.

EDI CON Online, an interactive event held for the first time September 10-12, 2019, has posted impressive results for its inaugural year with more than 4400 sessions attended to date. 97% of attendees surveyed noted they would attend another EDI CON Online, and 97% would also recommend the event to a colleague.

“There are two kinds of engineer, those who are building antennas on purpose and those who are not doing it on purpose.” Every oscilloscope ships with at least two 10x probes. They are ubiquitous in every lab. But they have a significant problem above 10 MHz, unless care is taken. In some cases, we can turn this problem into a feature.

The complex impedance value over frequency for an electric vehicle’s battery cell is a good measure of the internal cell temperature, the state of charge (SoC), and the state of health. Moreover, comparing the battery stack impedance with the single cell impedances can reveal upcoming high contact resistances. Read on for the details of how to do it.

What are the greatest technical challenges facing connector designs for future high-speed deployments?Jairo Guerrero of Molex delves into the technical challenges for today’s connectors, the influence of applications such as automotive and data/telecom, and he gives an intriguing glimpse into the product development process at Molex.

The ability to analyze and predict the current/temperature effects of isolated traces is helpful, but the actual temperature of a trace may be different because of uncertainties in the actual trace thickness or board material thermal conductivity coefficient. This article traces the effort to see what PCB board parameters have the most impact in determining trace temperatures, followed by a look at related PCB design considerations. Read on to learn more.

SIJ gets Dr. McMillan’s take on what matters for noise generation in SI/PI design, and how PAM4 is arriving.

The goal of power integrity (PI) analysis is to ensure not only sufficient but also stable power to all chips in a system. This article uses the example of a DDR4 application to explain the choices surrounding the use of decoupling capacitors to reduce impedance, and which performance parameters are critical to success.

Recently, Signal Integrity Journal caught up with Todd Cutler, Keysight’s VP and General Manager for Design & Test Software about product development, innovation, and the latest developments in SI/PI design.