Articles Tagged with ''PCB''

In high-speed circuit designs, power integrity (PI) and electromagnetic interference (EMI) are connected together. When the edge of the cavity created by power (PWR) and ground (GND) planes in PCBs radiates, the peak frequencies in the emissions are the same as the peak frequencies in the cavity self-impedance.

The power electronics engineer and the power integrity engineer share a common goal: provide the system with the correct voltages, currents, and noise characteristics to achieve the desired performance. Unfortunately, they do not share much else. They generally use different tools, vocabulary, and figures of merit. As a result, both sides lose.

Yuiry Shelpnev argues that simulating a link in isolation from the rest of the board (localization) is probably the most important requirement to simulate interconnects predictably. Read on to understand this important concept.

If we know how to design interconnects that correlate with the measurements for 28 Gbps NRZ, is it going to be a "free lunch" to move to 56 Gbps NRZ? Not so easily, as I learned recently. Read on to see how you can benefit from some analysis and validating your tools.