Articles Tagged with ''PCB''

By using Soluboard for its demo and evaluation boards, Infineon is making another important contribution to the testing of sustainable designs in the electronics industry.

In preparation for 224 Gb/s and beyond, Samtec engaged in a research project to characterize the transmission performance of emerging PCB material sets. Brandon Gore explores the current state of the art for PCBs and cables, comparing them and assessing the technology gap to fully support the insertion loss performance required for higher data rates.

Engineers can now design faster with ready-to-use symbols and footprints for Nicomatic’s micro connectors.

Successfully designing a PCB with more than one impedance while maintaining a manufacturable and economical product can be a difficult challenge. By examining the histories and uses of various impedances, Lee Ritchey simplifies the process and discusses the ideal impedance for PCB stackup design.

YINCAE, a leading manufacturer of high-performance electronic materials, has announced the release of its breakthrough product Thermal Underfill - UF 158A2.

In this article, Bert Simonovich explores how to avoid “garbage in, garbage out” with field solvers by building an understanding of the nuances of PCB fabrication processes, the interpretation manufacturers’ data sheets, and the tool’s user interface.

Keysight enhanced the x1149 Boundary Scan Analyzer with support for the new IEEE 1149.1-2013 and IEEE 1149.6-2015 standards, allowing advanced boundary scan testing beyond typical structural tests and significantly increasing test coverage on PCBs.

Featuring low 0.88 mm profile and wettable flanks, Automotive Grade 200 V, 400 V, and 600 V devices provide improved thermal performance and efficiency.

Teledyne e2v and Texas Instruments (TI) have collaborated on a new radiation-tolerant DDR4 modular platform to help satellite OEMs streamline their system development work.