Yuriy Shlepnev

Yuriy Shlepnev

Yuriy Shlepnev is a member of the Signal Integrity Journal Editorial Advisory Board & President and Founder of Simberian Inc., where he develops Simbeor electromagnetic signal integrity software.  He received M.S. degree in radio engineering from Novosibirsk State Technical University in 1983, and the Ph.D. degree in computational electromagnetics from Siberian State University of Telecommunications and Informatics in 1990. He was principal developer of electromagnetic simulator for Eagleware Corporation and leading developer of electromagnetic software for simulation of signal and power distribution networks at Mentor Graphics. The results of his research are published in multiple papers and conference proceedings.

ARTICLES

40 GHz PCB Interconnect Validation: Expectations vs Reality

What does it take to design PCB interconnects with good analysis-to-measurement correlation up to 40 GHz? Is it doable with typical low-cost PCB materials and fabrication process, typical trace width, via back-drilling and the shortage of space to place the stitching vias? This paper reports lessons learned from validation projects with the goal to build a formal procedure for systematic prediction of interconnect behavior up to 40 GHz. Topics include: selection of test structures, connectors and measurement equipment, and analysis uncertainties.

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Lessons learned: How to Make Predictable PCB Interconnects for Data Rates of 50 Gbps and Beyond

Design of PCB interconnects for data channels running at bitrate 50 Gbps and beyond is a very challenging problem that requires analyses and measurements over extremely broad frequency bandwidth from DC to 50 GHz and above. This paper shares our experience in building a practical methodology to make predictable 50 Gbps interconnects models.


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How Interconnects Work: Modeling Conductor Loss and Dispersion

Models of transmission lines and transitions accurate over 5-6 frequency decades are required to simulate interconnects for serial data channels operating at 10-100 Gbps. Extremely broadband modeling of conductor properties for such high-speed channels is a challenging task. This paper explains physics of the conductor-related signal distortion effects in PCB and packaging interconnects. After reading this paper, you should be able to setup simple experiments in your EDA tool to figure out the limitations and will be sufficiently qualified to ask your EDA tool vendor questions about the accuracy of the conductor modeling effects.


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