Yuriy Shlepnev

Yuriy Shlepnev of Simberian outlines the fundamental elements of DEA, examines the conditions for its accuracy, and highlights its growing importance in the future of interconnect design.

Crosstalk problems here to stay as long as interconnects are designed as the open waveguiding systems. Thus, understanding and proper quantification of the crosstalk and mitigation of the consequences are important. This article outlines multiple possible ways to quantify the crosstalk: coupling coefficients, frequency domain metrics, time-domain analysis of crosstalk, and a modern statistical approach. 

Crosstalk in PCB and packaging interconnects is arguably one of the most complicated phenomena that may cause signal degradation. Crosstalk effects can be treated statistically as a deterministic jitter with a bounded distribution, but the distribution is usually not known. A direct analysis of a worst-case crosstalk scenario may lead to a system overdesign. Neglecting it in design may cause a system failure that is difficult to find and fix later in a design process. Distortions caused by crosstalk cannot be corrected by signal conditioning techniques at a receiver side. It is very important to understand the sources of crosstalk, how to quantify it and how to mitigate it efficiently, as Yuriy Shlepnev demonstrates in this installation of the "How Interconnects Work" series.

In this article, Yuriy Shlepnev provides an overview of Simbeor electromagnetic signal integrity software and highlights its new features.

Modeling and measurement of digital serial interconnects is usually done in the frequency domain. That means that the minimal and maximal frequencies (or bandwidth) should be defined even before the analysis or measurement begins. This post introduces a simple and practical way to identify the bandwidth with a numerical analysis of defects in a single bit (SBR) or single symbol response (SSR).

Ever wonder how much energy is required to transmit data and why so much power is dissipated into heat? SIJ EAB member Yuriy Shlepnev takes a closer look.

SIJ editorial advisory board member Yuriy Shlepnev offers a comparison of three ways to visualize the same s-parameter data, identifying how to get the most information from a plot.

Bends in PCB traces look like very basic, simple structures that are easy to simulate. Technically, one can do the analysis with any electromagnetic solver with sufficiently accurate port de-embedding capabilities. The reflections from a bend in fine-line, high-speed digital interconnects are relatively small and may not even be detectable with measurement. So, who cares? Read on to find out more.

Those interested in automating signal integrity analysis using machine learning should take a look at this work, which includes an example of a 112 Gb SerDes system analysis.

Transverse electromagnetic waves are used to transmit the signal between components while PPW waves are used to deliver power to the components. Both waves are useful, but they have to be separated. Yuriy Shlepnev, member of the SIJ Editorial Advisory Board, explains why.