Signal Integrity

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Making Lemonade with the 10x Scope Probe

“There are two kinds of engineer, those who are building antennas on purpose and those who are not doing it on purpose.” Every oscilloscope ships with at least two 10x probes. They are ubiquitous in every lab. But they have a significant problem above 10 MHz, unless care is taken. In some cases, we can turn this problem into a feature.


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SIJ EXECUTIVE INTERVIEW_

Executive Q&A: Jairo Guerrero, Molex

What are the greatest technical challenges facing connector designs for future high-speed deployments?Jairo Guerrero of Molex delves into the technical challenges for today’s connectors, the influence of applications such as automotive and data/telecom, and he gives an intriguing glimpse into the product development process at Molex.


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PCB Trace Current/Temperature Relationships and their Dependencies

The ability to analyze and predict the current/temperature effects of isolated traces is helpful, but the actual temperature of a trace may be different because of uncertainties in the actual trace thickness or board material thermal conductivity coefficient. This article traces the effort to see what PCB board parameters have the most impact in determining trace temperatures, followed by a look at related PCB design considerations. Read on to learn more.


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Why Are There So Many Standards?

There seems to be more standards every day, and some have rumored that there is a movement to merge or consolidate some existing standards. We will examine some of the standards and how they came to be. For starters, we will limit ourselves to three main types of standards in the industry: on-board or internal, input/output (I/O), and networking. I/O and networking are similar, but networking standards typically apply to longer distance links than I/O standards. There is, as often happens, overlap between these types, and some, such as PCI-express, have standards that apply to more than one of them.


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Silicon Photonics: Past, Present and Future

Optoelectronic industry designers have traditionally used discrete optical devices for transceiver designs. The process requires manual integration of discrete free-space optical components such as lasers, modulator, photo detectors, isolators, MUX/DE-MUX, lenses in the form of optical gold box sub-assemblies such as transmit optical sub-assembly (TOSA).


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