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In this paper, Will McCaffrey examines the Analog Devices Inc. LTM4650A micro-module with an internal inductor, comparing the generated small-signal passive model from LTpowerCAD to a measured model using the LTM4650A evaluation board. 

This Best DesignCon paper demonstrates what happens when GRVs are too distant for the data rate at hand. Read on. 

What causes crosstalk? When does it become problematic? What can you do to ensure it does not ruin your product design? In this article, Donald Telian answers these questions and more.

Many systems fail to live up to expectations, frequently because of an implementation failure at the breakout region. In this blog, Travis Ellis, SI engineer at Samtec, discusses connector-to-board transitions and common impairments to their performance.

This DesignCon paper analyzes the mathematical/theoretical issue in the previous interference tolerance test standards, and discusses two types of reference TX jitter parameters estimation methods to solve or alleviate the issue. Read on. 

This article explores how signals are captured and converted from analog-to-digital or digital-to-analog in a lossless fashion. Read on.

This DesignCon paper concentrates on the diverse abilities of AWGs to generate the signals required for compliance to standards such as HDMI 2.1, MIPI C-PHY, MIPI D-PHY, and MIPI A-PHY. Read on. 

Ken Wyatt recommends planning in advance to install local shields for most critical wireless applications. Read on.

Incorporating the technique of using a quiet HIGH and quiet LOW I/O pin is a simple way of opening up a small window onto what is happening with the power rail of your die. Read on to have Eric Bogatin teach you how to implement it. 

This paper first gives an overview of high frequency aliasing issues in context with industry standard compliance testing, then discusses the anti-aliasing algorithm. Read on.