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Microstrip FEXT Reduction by Capacitive Compensation

Reduction of microstrip FEXT plays an important role in microwave engineering, as microstrip coupled line backward couplers suffer from poor directivity when not compensated. In this article, Henning Mextorf presents a general approach to improve directivity which does not require a modification of the dimensions of the coupled line structure and provides closed form solutions for optimum capacitor values.


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3D Connector Models Enhance Signal-Integrity Analysis

PCB connector suppliers are often tasked with providing connectors that meet today’s high-speed and high-density requirements. In many cases, these connectors also need to maintain signal integrity under harsh conditions. Such models make it possible to simulate how the connector will interface and perform in its surrounding environment. IEH has partnered with Modelithics to offer 3D geometry models for various IEH hyperboloid connector products.


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Avoiding GIGO with Field Solvers

In this article, Bert Simonovich explores how to avoid “garbage in, garbage out” with field solvers by building an understanding of the nuances of PCB fabrication processes, the interpretation manufacturers’ data sheets, and the tool’s user interface.


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Understanding Via Impedance

Signal Integrity, In Practice

In this article, Donald Telian supplies a reference point for making the task of implementing via impedances, thus removing via impedance discontinuities, less daunting. Read on to find out how he can help.


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