Lee Ritchey

Lee Ritchey

Lee Ritchey is considered to be one of the industry’s premier authorities on high-speed PCB and system design. He is the founder and president of Speeding Edge, an engineering consulting and training company. He conducts on-site private training courses for high technology companies and also teaches courses through Speeding Edge and its partner companies in public venues as well as at industry trade shows and technical conferences. In addition, he provides consulting services to top manufacturers of many different types of technology products including Internet, server, video display and camera tracking/scanning products.  He is currently involved in characterizing materials for ultra high speed data links used throughout the Internet.

Prior to founding Speeding Edge, Ritchey held a number of hardware engineering management positions including Program Manager for 3Com Corporation in Santa Clara and Engineering Manager for Maxtor. Previously, he was co-founder and vice president of engineering and marketing for Shared Resources, a design services company specializing in the design of high-end supercomputer, workstation and imaging products. Earlier in his career, he designed RF and microwave components for the Apollo space program and other space platforms. Ritchey holds a B.S.E.E. degree from California State University, Sacramento where he graduated as outstanding senior. 

ARTICLES

Glass Transition Temperature and its Effects on Printed Circuit Board Reliability 3-5-24.jpg

Glass Transition Temperature and its Effects on Printed Circuit Board Reliability

The expansion of the resin systems in laminates has been a source of reliability problems as the electronics industry has placed ever higher demands on those used in printed circuit boards. Suppliers of these resin systems have improved their resin systems to eliminate or minimize failures from expansion as the systems using the PCBs have been made more complex and subjected to ever harsher environments. Currently, the only technologies that still suffer failures from resin expansion with temperature are triple-high stacked blind vias, which Lee Ritchey explores in this article.


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What is This Material Called FR-4 Cover.png

What is This Material Called FR-4?

Within the PCB industry, FR-4 materials have long been accepted as “standard” materials. However, their use was not specific to the types of board being designed. For today’s high-speed, high-frequency designs, careful engineering and material selection relative to the resin systems and glass weave styles needed will ensure that a product will work as specified, as designed, and as manufactured. In addition, the finish of the copper used in the signal and power layers also needs to be controlled in order to ensure that loss goals are met.


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