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EDI CON Online Will Reach Global Audience

New online, interactive event held September 10-12 will give engineers the opportunity to attend free training sessions without leaving the office.

The Electronic Design Innovation Conference and Exhibition (EDI CON) announced that this year, in conjunction with Microwave Journal (MWJ) and Signal Integrity Journal (SIJ), it will host an online, interactive event for high frequency and high speed design engineers on September 10-12, 2019. 


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Comparing Embedded Coplanar Waveguide and Stipline for Multi-Layer Boards

It is important in high-speed digital applications to decrease the form factor and increase signal density by reducing isolating metal layers, all while preserving comparable crosstalk, loss and dispersion at the frequency of interest. This paper takes a look at how you can do that by showing how coplanar waveguide with smaller form-factor outperforms stripline in isolation and coupling.


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EDI CON China 2019

EDI CON China 2019 Event Summary

7th Annual Electronic Design Innovation Conference covering RF/microwave, EMC/EMI and SI/PI

EDI CON China 2019 returned to Beijing and the Chinese National Convention Center (CNCC) April 1-3 with an exhibition of 100 industry-leading companies as well as a technical conference that included 2 and a half days of technical presentations, workshops, panels and featured keynote talks.


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IEEE P370: A Fixture Design and Data Quality Metric Standard for Interconnects up to 50 GHz

The fixtures used to characterize interconnects in complex systems can have a significant effect on the measured data, read on to get the background and perspective on IEEE P370. Check out this Outstanding Paper Award Winner from EDI CON USA 2018.


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