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Eric Bogatin in episode 16 as he talks with Robert Feranec, president and CEO of Fedevel Academy, to learn about the go to spot for hardware engineers to sharpen their design skills.
IDTechEx’s new “Automotive Semiconductors 2023-2033” report focuses on the areas of automation and electrification, explaining what semiconductor technologies are needed and how their growth is going to drive a 10-year CAGR of 9.4% in the automotive semiconductor market.
A VNA equipped with time domain analysis that includes basic and advanced window and gating functionality can help produce more accurate and repeatable impedance measurements. Read on.
Teledyne e2v and Texas Instruments (TI) have collaborated on a new radiation-tolerant DDR4 modular platform to help satellite OEMs streamline their system development work.
This article provides a unified equation and quick rule of thumb for signal integrity engineers to determine how long of a pattern can be captured using their oscilloscope. Read on.
In part three of the Ultra-Fine Line Design Guide series, previously introduced methodology is used to explore the design space for a differential pair when the return plane is far enough away that coupling to it is negligible. Read on.
General Motors Co. (GM) and GlobalFoundries (GF) announced a strategic, long-term agreement establishing a dedicated capacity corridor exclusively for GM’s chip supply.
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