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Flex Power Modules and Bear VAI Technology are coming together to offer and support the Flex Power Modules range of DC/DC conversion products in the Midwest U.S.

The increasing demand for data processing is the primary driving force behind the growth in four key application areas. However, each application has specific requirements that necessitate different advanced semiconductor packaging technologies.

EDI CON China 2024 returns to Beijing and the Chinese National Convention Center April 9-10 with an industry exhibition as well as a technical conference.

Infineon Technologies AG and Schweizer Electronic AG are collaborating on an innovative way to further increase the efficiency of chips based on SiC.

Isola Group brings the latest cost-effective, high-performance PCB material solutions for hybrid circuits to this year’s Del Mar Electronics & Manufacturing Show.

According to IDTechEx’s latest 6G research, 6G could be with us in 2028 at the earliest. 

The collaboration addresses expanding market with solutions encompassing the design, deployment, delivery, and operations of dedicated 5G private networks.

ATIS’ Next G Alliance announced the publication of two new reports, "Sustainable 6G Connectivity—A Powerful Means of Doing Good" and "AI-Native Wireless Networks."

AI bottlenecks drive the adoption of optical interconnects for next-generation HPC systems.

Researchers have succeeded for the first time worldwide in generating and detecting photons with stable photon frequencies emitted from nitrogen-vacancy defect centers in diamond nanostructures.