Featured Stories

Boards

The Role of PCB Materials in Printed-Circuit Impedance

Printed circuits for high-speed and high-frequency applications rely on fine-featured transmission lines for signal transmission. Ideally, the loss through these transmission lines is minimal, and this requires an electrical impedance that is consistent and without interruptions, and with a value most appropriate for the types of signals to be transferred through the circuit. However, a number of factors can affect the impedance of a PCB, including the physical and electrical characteristics of the circuit and circuit material, but by reviewing and better understanding these variables, their effects can be minimized.


Read More
Figure 4

Practical DDR Testing: Compliance, Validation and Debug

DDR memory interfaces are becoming increasingly common, and present a unique set of challenges to those designing high-speed embedded systems.  This article will examine what DDR interface testing is all about, concentrating primarily on the physical layer and solutions to common problems.
Read More
EDI CON USA

High Speed Digital Symposium Launches at EDI CON USA 2017

Day two of the three-day conference includes an afternoon symposium on material characterization challenges in high-speed digital design led by session chair Eric Bogatin.

The Electronic Design Innovation Conference and Exhibition (EDI CON) USA announced the addition of a the High-Speed Digital Symposium to its conference line up during the event at the Hynes Convention Center, September 11-13 in Boston, Mass.

Read More