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Sometimes, when SI and PI worlds collide, we get the best of both worlds. By borrowing a simple impedance measuring technique from the PI world, we have another tool at our disposal to measure true characteristic impedance from a uniformly designed transmission line in the SI world, read on to learn more.

This article explains the steps to use a TDR to measure very small values of inductance and capacitance, including tips for better measurements.

Those interested in automating signal integrity analysis using machine learning should take a look at this work, which includes an example of a 112 Gb SerDes system analysis.

Uniform transmission lines are best suited for high-speed data transmission because of their broadband impedance characteristics. In some applications, a minor deviation from uniformity can help in optimizing other desired signal integrity metrics. This paper addresses some of the challenges involved with this approach.

Can common via structures transfer any data rate or are they limited with a defined bandwidth? If so, what limits its bandwidth? And what can be done when the bandwidth of the signal is greater than the bandwidth of the G-S-S-G structure? This technical feature from Dror Haviv explains.

It pains me to say this, but there is such a thing as turning the TDR up too high and it is also easy not to have enough. If there is a “too high,” and a “not high enough,” there must also be a “just‐right,” or Goldilocks, setting. Using measurements, and a smattering of math, the Goldilocks setting answers
will be clear. Read on to find out how.

Engineers who design and model power distribution networks require accurate component level models from high frequency down to DC.  Accurate modelling of power connectors can guarantee best power transfer and minimize power-induced noise.  In this paper, which won a DesignCon 2020 Best Paper Award, the authors analyze the frequency-dependent resistance and inductance of various power connectors as well as pin patterns.

When is it appropriate to have a continuous plane, split planes, or no planes under an RJ45 connector? This article from Zachariah Peterson takes a closer look.

Future data center and high-speed computation require faster connectivity to meet the increasing set of applications and bandwidth. IEEE and OIF have developed 106-112 Gbps per lane electrical interface specifications P802.3ck1 and CEI-112 G2 for the 400 GbE system. To meet the next-generation system bandwidth requirement, industry and standard bodies recently kicked off new projects aiming at 800 GbE or even higher speeds beyond 1 TbE. So what comes next beyond 112 Gbps for electrical interfaces over copper (Cu) channels? Will it be 224 Gbps?