Featured Stories

RSS

One of the main challenges of performing analysis upstream is incomplete models used in analysis. Normally the full physical layouts from which extractions are performed on interconnect do not yet exist. So how does one fill in the blanks to perform early analysis?

The most notable difference between DDR5 and previous generations is the introduction of decision feedback equalization, a technique used in serial link systems to improve the integrity of received signals.  In the wake of the new technology, this short article outlines some of the fundamental signal integrity concepts in the context of DDR5.

This article explains the steps to use a TDR to measure very small values of inductance and capacitance, including tips for better measurements.

We want to follow this mantra of 85 ohms for PCIe, but it may not be so easy. Here’s a look at exactly what the spec says, and what we can do about it.

Following best design practices for controlling EMI will increase your chance of success in your next design. But, sometimes knowing what not to do is just as important.

Gustavo Blando, a Samtec signal integrity architect, recently presented “DC Block Capacitor Location (Does It Matter)?” at a Samtec geEEk and spEEk webinar. Here he presents a summary of some of his key points.

Those interested in automating signal integrity analysis using machine learning should take a look at this work, which includes an example of a 112 Gb SerDes system analysis.

Mechanical needs and power limits are at odds with what is optimal for signal integrity. Having a metric that guides us to the sufficient SI choice rather than going for the optimal SI choice ultimately saves cost and decreases time to market. Read on for the details on Brandon Gore’s technique.

SIJ technical editor Eric Bogatin notes that there are some problems that occur over and over again across product families and applications. They have a handful of essential principles at their underlying root cause. In this blog, he explains that if we really understand these underlying principles, the root cause of the problems will be more apparent and their solutions closer to implement.

Recently, Cadence released its Clarity 3D Transient Solver for EMI simulation.  I caught up with Brad Griffin, product management group director for multi-physics system analysis in the Custom IC & PCB Group at Cadence to follow up for some more details.