Brandon Gore

Brandon T. Gore is presently a Principal Technologist at Samtec managing both the Signal Integrity R&D and Electronic Industry Standards teams. His research focuses are advanced interconnect materials, glass packaging, direct drive optics, and general signal integrity bottlenecks for 200 Gb/s data rates. He is an active contributor to both IEEE 802.3 and OIF Common Electrical I/O projects at 112 Gb/s and 224 Gb/s. Brandon received a PhD degree in electrical engineering from the University of South Carolina under Dr. Paul G. Huray.

Next-Generation PCB Loss Analysis

June 12, 2023

Brandon Gore

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In preparation for 224 Gb/s and beyond, Samtec engaged in a research project to characterize the transmission performance of emerging PCB material sets. Brandon Gore explores the current state of the art for PCBs and cables, comparing them and assessing the technology gap to fully support the insertion loss performance required for higher data rates.

Channel Operating Margin: An In-Context Channel Compliance Method

December 8, 2020

Brandon Gore

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Mechanical needs and power limits are at odds with what is optimal for signal integrity. Having a metric that guides us to the sufficient SI choice rather than going for the optimal SI choice ultimately saves cost and decreases time to market. Read on for the details on Brandon Gore’s technique.

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