Technical Articles

RF Module

Ten Tips for Best Board Design Practices for IoT Applications

This design guide focuses on small form factor and low power IoT products. Even though these sorts of products are not in the same performance class as server motherboards, not paying attention to signal and power integrity design principles at the beginning of the design cycle may require multiple board spins to get your IoT product working.


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BER- and COM-Way of Channel-Compliance Evaluation: What are the Sources of Differences?

We analyze the computational procedure specified for Channel Operation Margin (COM) and compare it to traditional statistical eye/BER analysis. There are a number of differences between the two approaches, ranging from how they perform channel characterization, to how they consider Tx and Rx noise and apply termination, to the differences between numerical procedures employed to convert given jitter and crosstalk responses into the vertical distribution characterizing eye diagrams and BER. We show that depending on the channel COM may potentially overestimate the effect of crosstalk and, depending on a number of factors, over- or underestimate the effect of transmit jitter, especially when the channel operates at the rate limits. We propose a modification to the COM procedure that eliminates these problems without considerable work increase.


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Ensuring High Signal Quality in PCIe Gen3 Channels

The increased data rates of today’s high-speed Input/Output (I/O) buses make maintaining transmission channel signal quality all the more challenging. One reason for the challenge is the parasitic effects that result from bus interconnects. Over the past decade, data rates for electrical interconnects have experienced a dramatic increase—from 1 Gbps to 25 Gbps and beyond—to meet the ever increasing demand for more I/O bandwidth from modern networking applications and high-capacity storage.


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A Practical Method to Model Effective Permittivity and Phase Delay Due to Conductor Surface Roughness

Presented at DesignCon 2017

In the GB/s regime, accurate modeling of conductor loss and phase delay is a precursor to successful high-speed serial link designs. In this paper, a practical method to model effective permittivity and phase delay, due to conductor surface roughness, is presented. By obtaining the dielectric and roughness parameters, solely from manufacturers’ data sheets, phase delay and effective permittivity can now be easily predicted. Detailed case studies and several examples test the model`s accuracy.


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Controlling Electromagnetic Emissions from PCB Edges in Backplanes

It is a well-known fact that electromagnetic radiation can be emitted from the edges of printed circuit boards (PCBs). When a current carrying via passes through two or more reference planes, an EM wave propagates radially away from the via within the cavity.  It is guided by the respective planes; much like a water ripple will propagate radially away from a rain drop hitting a puddle of water. When the wave meets the PCB edge, the two reference planes form a slot antenna and will radiate noise with the potential to generate electromagnetic interference (EMI) to nearby equipment.


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S-parameter Renormalization, The Art of Cheating

As you know, "us", Signal and Power Integrity Engineers, are full of tricks, rules of thumb, and shortcuts. These tricks mostly help us understand something, save analysis time and, why not, make us look smarter than we really are!! In that vein, seldom have I encountered a quick and dirty trick as useful and underestimated as S-parameter renormalization.


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Boosting SI Performance With Materials

Laminate selection plus careful design improves signal integrity and power integrity performance
This month on the Signal Integrity Journal, we are taking a closer look at the new materials options for enhanced SI or PI performance. I recently asked Martin Cotton, director of OEM technology for the Ventec International Group, how his company saw the new materials opportunities for designers.
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