Items Tagged with 'impedance'

This paper investigates via and trace coupling effects using measurements, hybrid, and full-wave solvers by de-embedding/calibration utilizing multiple test-boards.

Reduction of microstrip FEXT plays an important role in microwave engineering, as microstrip coupled line backward couplers suffer from poor directivity when not compensated. In this article, Henning Mextorf presents a general approach to improve directivity which does not require a modification of the dimensions of the coupled line structure and provides closed form solutions for optimum capacitor values.

Successfully designing a PCB with more than one impedance while maintaining a manufacturable and economical product can be a difficult challenge. By examining the histories and uses of various impedances, Lee Ritchey simplifies the process and discusses the ideal impedance for PCB stackup design.

In this article, Bert Simonovich explores how to avoid “garbage in, garbage out” with field solvers by building an understanding of the nuances of PCB fabrication processes, the interpretation manufacturers’ data sheets, and the tool’s user interface.

In this series, experts extend the exploration of design space to ultra-fine line features. Read on. 

Impedance is the most fundamental and important electrical property of any component. With a very simple technique, anyone can simulate the impedance of any circuit in seconds using any version of SPICE, for free. Read on to learn more.

Now that I am teaching full time and have a number of undergraduate and graduate students doing weekly project reviews, I listen to more presentations than I give. I find myself giving the same feedback over and over again. So, I thought I would share my eight most common comments and tips to engineers giving presentations.

In this Extreme Measurement Example, see how measurements were used to resolve the shield resistance issue, where the authors redesigned the PCB to clear the DUT contact, but also identified alternate solutions in the event they could not wait for a new PCB.

In this tongue-in-cheek experiment that leads to actionable conclusions, Ben Dannan and Steve Sandler set out to discover a method to mitigate the lack of an isolation calibration step on a VNA.

Designing the right PCB stackup can make or break product performance. If the product has circuitry that is impedance and transmission loss sensitive, then paying attention to conductor surface roughness is paramount. Sometimes, however, the roughness of adjacent reference plane(s) is overlooked. If the adjacent high-speed signal layer uses smoother copper than one or both reference planes, a higher insertion loss than expected for that layer will occur and possibly cause a product to fail compliance. So, how is this determined before finalizing the stackup? Read on to find out.