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A Practical Method to Model Effective Permittivity and Phase Delay Due to Conductor Surface Roughness

Presented at DesignCon 2017

In the GB/s regime, accurate modeling of conductor loss and phase delay is a precursor to successful high-speed serial link designs. In this paper, a practical method to model effective permittivity and phase delay, due to conductor surface roughness, is presented. By obtaining the dielectric and roughness parameters, solely from manufacturers’ data sheets, phase delay and effective permittivity can now be easily predicted. Detailed case studies and several examples test the model`s accuracy.


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Controlling Electromagnetic Emissions from PCB Edges in Backplanes

It is a well-known fact that electromagnetic radiation can be emitted from the edges of printed circuit boards (PCBs). When a current carrying via passes through two or more reference planes, an EM wave propagates radially away from the via within the cavity.  It is guided by the respective planes; much like a water ripple will propagate radially away from a rain drop hitting a puddle of water. When the wave meets the PCB edge, the two reference planes form a slot antenna and will radiate noise with the potential to generate electromagnetic interference (EMI) to nearby equipment.


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S-parameter Renormalization, The Art of Cheating

As you know, "us", Signal and Power Integrity Engineers, are full of tricks, rules of thumb, and shortcuts. These tricks mostly help us understand something, save analysis time and, why not, make us look smarter than we really are!! In that vein, seldom have I encountered a quick and dirty trick as useful and underestimated as S-parameter renormalization.


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Pop Quiz: When is an Interconnect Not a Transmission Line?

Hint: nudge, nudge, wink, wink, trick question

The Spring semester is starting at the University of Colorado, Boulder and the next batch of graduate students are taking my signal integrity course. To encourage students to be on time, I use a carrot and a stick. The carrot is a joke of the day and the stick is a pop quiz that happens as soon as class starts.


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Ventec's tec-speed

Boosting SI Performance With Materials

Laminate selection plus careful design improves signal integrity and power integrity performance
This month on the Signal Integrity Journal, we are taking a closer look at the new materials options for enhanced SI or PI performance. I recently asked Martin Cotton, director of OEM technology for the Ventec International Group, how his company saw the new materials opportunities for designers.
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