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An Outstanding Paper Award Winner at EDI CON USA 2017, this paper investigates SERDES performance in a multi-board system. The goal is to identify the cause of data transmission errors and variability between different differential pairs on the same board and between several boards.  Numerical and experimental investigations are carried out on a test board supporting several interfaces operating at 16 Gbps and above, with recommendations to improve performance.    

Design of PCB interconnects for data channels running at bitrate 50 Gbps and beyond is a very challenging problem that requires analyses and measurements over extremely broad frequency bandwidth from DC to 50 GHz and above. This paper shares our experience in building a practical methodology to make predictable 50 Gbps interconnects models.

This article discusses some of the common SI and EMI issues that can be found using DRCs.

How do you design power for sensitive circuits including LNAs, clocks, and PLL circuits? Although these circuits consume low power, they are sensitive to even very low levels of power rail noise. This EDI CON USA 2017 Outstanind Paper Award wining paper discusses the various noise paths that contribute to the degradation of the sensitive circuit as well as how to optimize, measure, and troubleshoot power supply related noise for these applications.

As Dave Dunham from Molex Corp. likes to say, "When designing high-speed serial links beyond 10 GB/s, everything matters." In order to ensure first time success at these speeds, accurate channel modeling is a prerequisite. This is especially true for long backplane channels.

The EDI CON USA 2017 keynote speakers addressed the latest engineering trends and challenges in our industry from “in the trenches” stories of design challenges, successes and failures from “Bet Your Job” to “5G in 5 Years” look into the future to a behind the scenes look at T&M. Below are full videos of these featured talks delivered on Sept 12 in Boston.

Each of the five experts presented a different approach to incorporating material properties in simulations to accurately predict a channel’s performance. Read on to see what they had to say.

This paper, presented at EDI CON USA 2017, demonstrates the use of a special probe tip utilized to convert a differential measurement of inductor voltage to a measurement of inductor current. It shows the connection and calibration considerations in the measurement of inductor current, including the digital signal processing algorithms required to compensate for the components in the power supply and the probe tip. It also explains current sharing measurements made in the time and frequency domain using a transient current generator.