Dr. Karl Joseph Bois

Dr. Karl Joseph Bois is the Lead Signal Integrity and System Interconnect Engineer at Hewlett Packard Enterprise in the Converged Data Infrastructure Division. His product influences are in high speed servers, switches, blades, and enclosure design. His current interests are signal integrity analysis of next generation computer chip packages and PCB, development of modeling techniques for transmission line structures, and implementation of test benches for experimental verification. He has authored and coauthored over 40 journal publications, conference presentations and proceedings, technical reports and overview articles. He has also been granted more than 29 patents, with more than another 12 pending.

Better, Faster, More Confident 25+ Gbps Via Design: Applying Decomposition and Image Impedance

May 9, 2017

Ben Toby and Dr. Karl Joseph Bois

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This method enables designers to create 25+ GT/s vias quickly, deliberately, and with much less uncertainty than the traditional technique. Read on to find out more.

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