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PC Board Design for Low EMI in IoT Products

Most of today’s digital-based products create a large amount of on-board RF harmonic “noise” (EMI). While this digital switching won’t usually bother the digital circuitry itself, that same harmonic energy from digital clocks, high-speed data buses, and especially on-board DC-DC switch-mode power supplies can easily create harmonic interference well into the 600 to 850 MHz cellular phone bands and even as high as 1575 MHz GPS/GNSS bands, causing receiver “desense” (reduced receiver sensitivity).


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Design for AMI: A New Integrated Workflow for Modeling 56G PAM4 SerDes Systems

In the future, the complexity of circuit implementation will increase dramatically and modeling of high-speed SerDes systems will continue to be a huge challenge. Modeling equalization circuit characteristics has become extremely important to ensure the success of the final platform implementation and provide a strong signal integrity design guide. This paper reviews the common challenges of converting an existing detailed architectural model to an IBIS-AMI model and some of the ways to address these challenges. It also includes an illustration of the workflow to model Intel’s 56G PAM4 SerDes.


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Seriously Funny Science Worth Watching

The Ig Noble Prizes are awarded every year for an individual or group who “did something that makes people laugh and then think.” In our time of increased stress what a perfect combination of activities for engineers to participate and experience: laughing and thinking.


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Convergence: Key to 224 Gbps PAM4 System Design

Convergence in technology is not a new idea. The concept infers that disparate technologies evolve to a closer association or integration over time. Convergence occurs when any number of technologies, such as micro twinax cables, ASIC design, interconnects, advanced IC packaging, and others combine to offer a unique system-level solution. Many see convergence as required for 224 Gbps PAM4 system performance. 


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Surface Scan on IC Level with High Resolution

The development of a low-noise emission PCBs is becoming more difficult because of higher integration densities, faster clock cycles, as well as integrating more radiators like wireless capabilities on to the IC. Based on these design challenges, it is essential to get all of the necessary information for the electric parts before they are placed on a customer’s PCB. Read on for advice on how to detect electromagnetic disturbances above ICs.


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The Truth About High-Speed Connector Design

It’s Not as Simple as Just Putting Metal and Plastic Together

In the high-speed connector design arena, there are two opposing ideas. For some people, if you simply put pieces of plastic and metal together, eventually you have a signal transmission. This process is very simple. On the other end of the spectrum, there is the idea that a solid connector design requires a deep understanding of electromagnetic theory, a wisdom only sorcerers and wizards possess.


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