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Teledyne e2v and Texas Instruments (TI) have collaborated on a new radiation-tolerant DDR4 modular platform to help satellite OEMs streamline their system development work.
This article provides a unified equation and quick rule of thumb for signal integrity engineers to determine how long of a pattern can be captured using their oscilloscope. Read on.
In part three of the Ultra-Fine Line Design Guide series, previously introduced methodology is used to explore the design space for a differential pair when the return plane is far enough away that coupling to it is negligible. Read on.
General Motors Co. (GM) and GlobalFoundries (GF) announced a strategic, long-term agreement establishing a dedicated capacity corridor exclusively for GM’s chip supply.
This article presents case studies where troubleshooting tools such as RF current probes and resistive probes proved effective in troubleshooting low-frequency conducted emissions. Read on.
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