Articles Tagged with ''EMI''

Current density can be an interesting concept. Graphics based on current density can be fascinating. But from a practical standpoint, current density is irrelevant. It is a consequence of other things, not a determinant of them. What follows will explain why.

This article lays out the basics of signal integrity problems, explains s-parameters, and identifies challenges in high-speed design.

Recently, Signal Integrity Journal caught up with Todd Cutler, Keysight’s VP and General Manager for Design & Test Software about product development, innovation, and the latest developments in SI/PI design.

An increasing number of manufacturers are adding or retrofitting wireless technology into new or existing products. These products typically include mobile, household, industrial, scientific, and medical (ISM) devices. This transition towards “everything wireless” is in full swing, and with it comes problems with electromagnetic interference (EMI) from the product itself interfering with sensitive on-board cellular, GPS/GNSS, and Wi-Fi/Bluetooth receivers. Read on to find out what to do about it.

SIJ had the opportunity to engage with Larry Williams, ANSYS director of technology, to find out his thoughts on how modeling and simulation needs have changed, how the industry has responded, and what’s next. At ANSYS, Larry Williams is responsible for the strategic direction of the company’s physics simulation products.

This paper details a methodology of using multiple Huygens Boxes on the coupling path to predict RFI/desense at early design stage in mobile devices—all with an aim to minimize the RFI.

This detailed analysis offers a comparison of various calibration methods for pulse generators according to IEC/EN 55016-1-1 (CISPR 16-1-1), where the spectrum amplitude is measured using different methods and then the results are compared and the measurement uncertainty is determined.

The third Electronic Design Innovation Conference (EDICON), was held Oct 17-18, 2018 in Santa Clara. The attendees were treated to two days of technical talks, tutorials and tradeshow with the overlapping topics of RF, SI, PI and EMI. This is a unique combination, allowing cross fertilization between these otherwise separate fields.

SIJ talked with Martin Stumpf about industry trends, how to foster innovation, and what today’s designers need most from their test equipment.