Articles Tagged with ''EMI''

In this inaugural post in his new Practical EMC blog on Signal Integrity Journal, Kenneth Wyatt lays out the major tools to troubleshoot and test for EMC compliance.

As a closing gesture to the SI, PI, and EMC/EMI community, we want to leave all of you with a year-end holiday gift for your continued support.

Poorly designed interconnects can contribute to near field emissions, which is sometimes an indication of EMI failures, read on to see how to avoid failing an FCC test.

This article presents a quick and easy simulation model for filter performance analysis. The simulation model that the author built matches the test results quite well and it can serve as a useful and powerful tool for electronics design engineers.

Ranatec's latest product, the RI 4901 EMI ventilation panel, is developed for test houses and wireless device vendors, the high performance EMI ventilation panel provides a robust 105 dB shielding efficiency of up to 9 GHz. 

Most of today’s digital-based products create a large amount of on-board RF harmonic “noise” (EMI). While this digital switching won’t usually bother the digital circuitry itself, that same harmonic energy from digital clocks, high-speed data buses, and especially on-board DC-DC switch-mode power supplies can easily create harmonic interference well into the 600 to 850 MHz cellular phone bands and even as high as 1575 MHz GPS/GNSS bands, causing receiver “desense” (reduced receiver sensitivity).

Many claim that for stripline, it is ok to cross a split power plane, so long as the other adjacent reference plane is solid. Some others claim if there is an adjacent solid reference plane, less than 5mils away under the split, crosstalk will be mitigated. Read on to see an investigation into what really happens when stripline signals cross split power planes.

Transverse electromagnetic waves are used to transmit the signal between components while PPW waves are used to deliver power to the components. Both waves are useful, but they have to be separated. Yuriy Shlepnev, member of the SIJ Editorial Advisory Board, explains why.

Low-speed printed circuit board (PCB) designs now have to deal with high-speed switching problems. This article examines the ground bounce generated from an LCD assembly while evaluating the impact of the ground bounce on the system level EMI. Three solution strategies to mitigate the ground bounce are analyzed, the pros and cons of each strategy are provided along with the test results.

Automotive design has captured the public’s imagination, and their expectations are creating countless technical challenges for engineers working in this space. For SI/PI/EMC/EMI engineers, the challenges are unique inside the car due to harsh environments as well as crowded systems.