Signal Integrity

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At DSEI Japan, Teledyne SP Devices demonstrated the industry’s first implementation of peer-to-peer streaming between commercial-off-the-shelf digitizers and GPUs in PXIe Systems.

In this article, Bert Simonovich explores how to avoid “garbage in, garbage out” with field solvers by building an understanding of the nuances of PCB fabrication processes, the interpretation manufacturers’ data sheets, and the tool’s user interface.

Eric Bogatin takes a closer look at the potential consequences of the widening gap between industry demand and the supply of engineers with signal integrity design skills, and poses potential solutions to inspire future generations of signal integrity engineers.

Solutions will test edge-to-core O-RAN subcomponents to verify interoperability and measure performance during competition.

IDTechEx evaluates the benefits and challenges of embedding electronic functionality. 

To meet demands for fast-charging protocol in USB-C-based DC power sources, Infineon Technologies AG has released the EZ-PD PMG1-B1 complementing the EZ-PD PMG1 family of high-voltage microcontrollers with USB-C power delivery.

Demonstration achieves the first 310 GBaud rates using on-off keying modulation and 160 GBaud rates using PAM6 modulation with direct detection systems.

Keysight will participate at embedded world 2023 to showcase how design, emulation, and test expertise can create the best embedded design experiences with intelligent insights to empower IoT networks, autonomous driving, and batteries.

Industry leaders join forces to meet the next generation needs of service providers, 
5G telecom, and fixed access operators.